系统级封装

基于界面强度的系统级封装结构及工艺参数优化研究

Research on Optimization of Structure and Process Parameters for SiP Based on Interface Strength

系统级封装（SiP）的随机振动分析

System-in-Package ( SiP ) Random Vibration Analysis

系统级封装（SIP）技术及其应用前景

Technology of System in Package and Its Applications Prospects

系统级封装（SIP）寄生效应小、集成度高的优点特别适合用来封装RF-MEMS系统。

The SIP ( system in a package ) with lower parasitic effect and higher integration satisfy the RF-MEMS system .

在这三层架构结构中，表示层与业务逻辑层都在STRUTS原有基层上进行深层的扩展，数据访问对象层主要通过对数据访问对象类进行系统级封装。

In the three layers , the view layer and the mode layer are the deeper expansion on the primary base of the Struts , the data access object layer mainly do the system level encapsulation through data access object class .

系统级封装中一种新型埋入式电源滤波结构的测量

The measurement of a Novel embedded power filter structure in System-in-Package

概述了射频系统级封装的设计、仿真和测试的方法和步骤。

The design , simulation and testing process of RF system SiP are given .

系统级封装：系统级芯片解决方案的有力补充

System-in-Package , A Complement to SoC Solutions

因此，探索系统级封装中无源元器件的综合方法，解决元器件高性能与高密度集成之间的矛盾，研发系统级封装可集成的多层嵌入式高性能小型化元器件已经变得非常重要。

Therefore , it is very important to develop synthesized method of passive components , resolve the contradiction between high performance and high density .

在系统级封装&未来集成电路发展的方向之一中，由于其系统设计、电路功能、信号特征和工艺实现的复杂性，系统的电、热特性必须要综合考虑。

System in package ( SiP ), as one of the promising options of future IC , has to be comprehensively considered from electrical and thermal perspectives due to its great complexities of system design , circuit function , signal feature , and technology implementation .

射频系统的系统级封装

System-in package for RF system

晶片级封装、系统封装、芯片级封装是现在第三次革新的产物，其目的就是将封装减到最小。

We are on third step now , many companies are developing Chip Scale Package ( CSP ) System In Package ( SIP ) , Wafer Level Scale Package ( WLSP ) etc to get the highest density .

这就使得基于LTCC的多层基片集成波导椭圆、准椭圆滤波器在微波、毫米波通信系统中的应用潜力巨大，有望成为系统级封装（SiP）中重要的组成部分。

So the elliptic and quasi-elliptic SIW filters based on LTCC will show tremendous potentials in microwave and millimeter-wave communication systems , and may become an important component of system in package ( SiP ) .

随着电子信息系统向多功能、小型化、低成本方向快速发展，人们对系统级封装（SystemonPackage，SoP）中各类高性能小型化微波无源元件的需求越来越强烈。

With the rapid development of electronic information systems to multifunction , miniaturization , and low cost etc. , there are more and more urgent demands on high performance miniaturized microwave passive components for system on package ( SoP ) technology .