表面贴片封装
- 网络surface mount
表面贴片封装-
翻转芯片焊球点阵排列是一种表面贴片封装技术，使用翻转芯片与焊球点阵排列相结合的结构。
Flip Chip Ball Grid Array , is a type of surface mount package which bridges the gap between flip chip and surface mount technology , using a combination of flip chip and BGA structures .
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总体说来，它大概有三次重大的革新：第一次是在上世纪80年代从引脚插入式封装到表面贴片封装，极大地提高了印刷电路板上的组装密度；
General speaking , It has three significant steps of innovation : first is the translation to surface mounting package from through hole package in the end of last eighties , it significantly increase the density of printed wire board ;