导电胶粘剂

焊料的无铅化是无铅封装的关键，目前无铅焊料的研究集中在Sn基焊料和导电胶粘剂两个方向。

Lead-free solder is the key to electronic assembly engineering ( lead-free package ) . Now the research on lead-free solder focuses on two fields : Sn base solder and conductive adhesive .

导电胶粘剂的研究进展

Progress of Studies on Conductive Adhesive

各向异性导电胶粘剂膜（ACF）是由导电粒子、粘结剂、添加剂组成的各向异性高分子薄膜。

Anisotropic conductive film ( ACF ) is a kind of anisotropic polymer film , which consists of conductive particles , adhesive and additives .

新型改性石墨/环氧树脂导电胶粘剂的研究

Study on Novel Modified Graphite / Epoxy Resin Conductive Adhesives

纳米导电胶粘剂的研究

The study on new conductive nano - adhesive

各向异性导电胶粘剂膜的研究进展

Progress in Research of Anisotropic Conductive Adhesives Film

导电胶粘剂的现状与进展

Present situation and progress on electrically conductive adhesives

新编辑手记纳米导电胶粘剂的研究

The study on new conductive nano-adhesive

介绍了GSD&T型铜粉导电胶粘剂各组分的选择，特殊铜粉的制备、配方和使用工艺条件。

Introduces selection of component in GSD_T type copper powder electric conductive adhesive , preparation of specific copper powder , compounding and condiction of processing .

综述了导电胶粘剂的分类、导电机理及导电胶粘剂的组成，指出导电胶粘剂的研究正向高导电率、低热阻、更可靠性的多功能化方向发展，并预期导电胶粘剂的应用前景是广阔的。

In the paper , classification of the conductive adhesive , conductive mechanism and making up were summarized , the development prospect of the conductive adhesive was put forward .

介绍了导电胶粘剂的导电机理，讨论了导电载体（填料）的类型、形状以及粘料（树脂）等对导电胶粘剂性能的影响。

The electric conduction mechanism of electroconductive adhesive was introduced and the effect of type and shape of conductive filler ( padoling ) and resin binder on conductive adhesive performance was discussed .

导电型胶粘剂的研究进展

Research progress of the conductive adhesive

导电及防静电胶粘剂体电阻率的测定分析

Analysis on Measurement of Bulk Resistivity of Electric of Adhesive