集成电路封装

电子陶瓷薄膜是片式电子元器件制造和大规模集成电路封装的关键薄膜材料，它是在高精密流延机上利用电子陶瓷浆料流延获得的。

Electronic ceramic thin tape is a kind of key materials for electronic chip components fabrication and IC packaging . They can be cast by the use of electronic ceramic slurry in a high precision tape casting machine .

这些要求加速了电子工业及精密机械的飞速发展，微型产品被越来越广泛地应用于移动电话、手提电脑、微型导航系统、集成电路封装、医疗器械和微型传感器等行业。

The micro products are widely used in cell phone , laptop , micro navigator , IC encapsulation , medical appliances and micro sensors .

超高速GaAs集成电路封装材料、工艺和结构的研究

Research on Packaging Materials , Processes and Structures for Ultrahigh-Speed GaAs ICs

EMC组分中含卤素阻燃剂的禁用以及集成电路封装工艺中含铅焊料的禁用使得传统EMC的组成与特性都有待改善。

The compositions and properties of the present EMCs are remained to improve for the sake of the forbidden uses of halogen-containing flame-retardants and the lead-containing solder .

TAB（载带自动焊）代表一种新的集成电路封装概念，它具有封装体积小、价格低、密度高等优点。

TAB ( tape Automated bonding ) represents a new concept for IC assembly process . It can provide the advantage of small volume , low cost and high density .

针对具体的集成电路封装结构以及特定的封装材料，该软件利用有限差分数值算法（FDM），求解三维热扩散方程；

For specific IC packages and special packaging materials , the simulator solves 3-D thermal diffusion equation by using the finite difference method ( FDM ) .

高集成无线收发器的集成电路封装天线（Integrated-CircuitPackageAntenna，ICPA）需要同时工作在2.4GHz和5.25GHz的双频段上。

Integrated-Circuit Package Antenna ( ICPA ) for highly integrated wireless transceivers , is required to operate concurrently on dual-frequency at 2.4 GHz and 5.25 GHz .

集成电路封装的三维热模拟与分析

Three dimensional simulation and analysis of thermal performance of microelectronic package

GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法外皮或包膜一个包装壳或外壳

Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

压阻型集成电路封装应力测试芯片的研究与应用

Study and Application of Piezoresistive Stress Test Chip for IC Packages

用于表面安装的集成电路封装系列。

A family of integrated circuit packages for surface mounted assembly .

集成电路封装高密度化与散热问题

The Development and Heat Dispersion Problem in Integrate Circuit Packaging

半导体集成电路封装测试工厂生产能力提升研究

Study on Capacity Improvement of Semiconductor Assembly and Test Factory Test & Measurement

集成电路封装陶瓷外壳埋线电阻的设计

Design of Buried Resistor of Ceramic Package for IC

集成电路封装用环氧树脂模塑料性能影响因素研究

Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging

半导体器件和集成电路封装的发展趋势

Trend of Packages for Semiconductor Devices and IC 's

集成电路封装用新型Al-1%Si键合线的研制

Study on a New Al-1 % Si Bonding Wire for Encapsulation of Integrate Circuit

集成电路封装的发展方向是高密度、低成本和高可靠性。

The high reliability and low cost will lead thedevelopment of the electronic packaging .

GB/T14113-1993半导体集成电路封装术语

Terminology of packages for semiconductor integrated circuits

大规模集成电路封装用环氧树脂复合材料流动性影响分析

Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit

半导体集成电路封装用环氧树导电胶概论

An Semiconductor Integrated Circuit Package to Epoxy

在回顾现有的引线键合技术之后，文章主要探讨了集成电路封装中引线键合技术的发展趋势。

After reviewing current wire bonding technology , wire bonding technology development trends are discussed .

公司的主要业务是集成电路封装测试和内存模块装配。

The Company 's primary business is IC component packaging and test and memory module assembly .

集成电路封装应力是影响芯片生产的成品率和可靠性的关键因素。

Stresses induced by packaging is a key factor that influences yield and reliability of IC products .

双马来酰亚胺树脂体系在封装基板上的应用集成电路封装基板过孔电学仿真技术研究

Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate Electrical Simulation Research for IC Package Via

很多的学者研究发现，金线越来越不适合多引脚的集成电路封装。

Many scholars found that gold was more and more unsuitable for multi pins of the IC encapsulation .

自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。

The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation .

本文运用有限元方法对多热源条件下集成电路封装的热场进行了模拟和分析。

In this paper , the temperature distribution of a package with multiple heat resources was simulated and analyzed .

介绍了电子集成电路封装行业中常见的锡须的形状及长度。

The usual shapes and lengths of tin whisker in electronic integrated circuit ( ECI ) encapsulation industry were introduced .

以有限元方法为基础的计算机模拟技术在集成电路封装热设计中是一种重要的热模拟和分析工具。

Computer simulation based on finite element method ( FEM ) is an important tool in the analysis of thermal performance of microelectronic packages .