封装方式

电感耦合无线互联三维堆叠封装方式是一种纯物理的提高电路集成度的方式。

Inductively coupled wireless connection 3-D stacked package is a pure physical way to improve the integration level of circuits .

第三，研究了PLC分路器的封装工艺，同时介绍了几种不同的封装方式。

Third , the package process is researched . And we introduce several different packaging modes , including the glue selection .

本文主要介绍了一种新的石油勘探MEMS传感器的结构特点、介质材料以及封装方式，并详细地介绍了该产品的主要技术指标。

The paper mainly introduced a new MEMS sensor of oil exploration , characters of MEMS sensor structure , medium material and sealed form as well as already reached technical indexes .

在微软的.net平台上设计并实现了一个企业应用集成数据总线，提供了以WebServices为封装方式，以XML格式的文本作为数据载体的数据接口，实现了一个轻量级的应用集成框架。

We design and implement an EAI data bus under Microsoft net platform , provide a data interface which packed as Web Services , and which uses XML format text as the main carrier . Thus we develop a light EAI framework based on XML-bus .

根据实际运用对标准RTP/RTCP协议进行简化，在不超过网络MTU的前提下，对音视频数据设计了独自的RTP封装方式。

According to the practical application , simplify the standard RTP / RTCP protocol . Under the premise of no more than the network MTU size , design different encapsulations .

概要介绍了IPSec协议和网络地址转换（NAT）协议的基本原理，着重介绍了IPSec协议与NAT协议所存在的矛盾，最后介绍了采用UDP封装方式实现IPSec报文穿越NAT的完整方案。

This article introduces the basic theory of IPSec and network address transform ( NAT ) protocol at first , then introduces the conflict between IPSec and NAT protocol ; at last , explains the way to solve this conflict IPSec NAT-traversal by UDP encapsulation .

提出了一种硬件方法封装方式并给出了详细流程。

A way of hardware method encapsulation and the corresponding detailed flow are proposed .

这种方法能实现传统无法实现的新型封装方式。不同的无机物以往是无法紧密封装在一起的，利用这点我们可以制造出如线一般细的充电电池来。

This method could be used for novel new products by weaving together the virus strands into flexible , thread-like rechargeable batteries capable of being woven into fabric .

为此，各个产家和研发机构都采取了不同的封装方式来解决，但总存在着热沉级数过多、热阻过大的问题。

Many production companies and institut have adopt different measures to solve this problem , but all this methods has its disadvantages : heat sink series too much and thermal resistance too huge .

本文根据测量爆炸冲击波中对测压传感器的要求，提出高频动态硅集成式压力传感器结构及封装方式。

According to the requirement for pressure transducers in blast wave measurement , in this paper , we present the configuration of a kind of high frequency dynamic silicon integrated transducer and its sealing technique .

采用MIME封装的方式可将二进制数据直接嵌入XML文档。

Binary data can be embedded in XML by MIME encapsulation method .

OSGi框架的第一层称为模块层，该层定义以良好封装的方式共享类定义和资源的方法。

The first layer of the OSGi framework is known as the module layer , which defines the ways in which class definitions and resources can be shared in a well encapsulated manner .

另外，可以在小部件的HTML标记中使用iContext对象来以封装的方式调用iScope类的相关实例的方法。

Additionally , the iContext object can be used in the HTML markup of the widget to call a method of the associated instance of the iScope class , in an encapsulated way .

服务系统有效解决了资源的分配问题，达到了以服务封装的方式来管理资源，给用户更好的体验。

Service system is an effective solution to the problem of the allocation of resources and it is to use a package of services to manage resources so that brings a better experience to the users .

Web服务作为SOA的主流实现方式，正逐步成为网络环境中资源封装的标准方式。

As the main technology to implement SOA , Web service is gradually becoming the standard way to package network resources .

这个数组封装器以多种方式提高了一个整数数组的功能。

This array wrapper class enhances the functionality of an integer array in a number of ways .

同时文中阐述了传感器的封装工艺以及封装材料铺层方式对测量结果的影响等。

At the same time , the encapsulation technique and the influence of encapsulation methods to results are expatiated in the work .

对于要求高灵敏度和快速响应的传感器封装，小型和球型的封装方式总是被推荐的。

Small and ball-shaped encapsulation is always recommended for high sensitive and fast-response sensor packaging .

在市场上逐步推广的液晶模块（LCM）生产中，其LCD系列驱动电路的封装工艺主要采用裸芯片的COB（chiponBoard）封装方式。

In mass production of LCD module under widely developed market , the assembly process of LCD drive circuits is based on COB ( Chip on Board ) technique .

针对目前商用陶瓷气体传感器功耗大、封装难的缺点，提出一种陶瓷微加工微热板式气体传感器的结构和无内引线封装的方式。

A novel gas sensor based on micro-machined ceramic hotplate and a wire-free bonding is presented , which is aim at the shortcomings of high power consumption and difficult to package existing in the current commercial ceramic gas sensors .