内存封装
- 网络Memory Package
内存封装-
CSP引发内存封装技术的革命
CSP Causes the Revolution of Memory Chip Package Technology
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CSP是内存芯片封装技术的新概念，它的出现促进内存芯片的发展和革新，并将成为未来高性能内存的最佳选择。
CSP has developed and innovated the memory chip since it was appeared . It is believed that CSP will be the best choice of the memory with high performance .
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嵌入式操作系统封装层中内存管理封装的设计
Design of Memory Manage Encapsulation in Embedded Operating System Encapsulated Layer
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本文简要介绍了几种内存芯片封装技术的特点。
Characteristics of several advanced chip package technology are introduced in the paper .
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本文主介绍了国际上内存芯片封装技术的现状以及未来的发展等。
The current situation and future of memory chip package technology are introduced in the paper .