镀铜添加剂

在硼酸镀液中以单晶Si（111）为基底用双槽法制备Cu/Co多层膜，在镀液中分别加入了镀铜添加剂2000和镀钴添加剂5。

Cu / Co multilayers were prepared on monocrystalline silicon ( 111 ) by using double-bath method in boric acid solution with additives added .

无染料酸性镀铜添加剂的发展状况

Review on Current State of Additives for Non-Dye Acidic Copper Electroplating

将至今所使用的酸性镀铜添加剂分成六类进行了归纳叙述；

Additives used in acidic copper electroplating are reviewed in six categories .

关于化学镀铜添加剂的研究（一）

On the addition agents in electroless copperplating (ⅰ)

酸性镀铜添加剂的作用与浓度测定

Determination of the Effect and Concentration of Additive SC-I in Acid Copper Plating Bath

新型酸性镀铜添加剂及光亮剂简介

Additives and Brightening Agent for Acidic Copper Plating

研究了酸性光亮镀铜添加剂四氢噻唑硫酮的电化学行为，提出了表面络合放电的整平作用机理。

Electrochemical action of adding agents in acidic Cu plating bath is studied and a new leveling mechanism is put forward in this paper .

研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。

A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated .