镀铜

石油钻杆刷镀铜废水处理

Treatment of copper facing water of petroleum drilling rod

本文对Kevlar面板Nomex蜂窝夹层结构表面粘贴镀铜箔聚酰亚胺薄膜的工艺进行了研究。

This paper study the technology of kevlar / Nomex honeycomb sandwich sticking up copper facing polyimide film .

SiCp表面化学镀铜工艺研究

Study on the Process of Electroless Copper Plating on SiC_p

化学镀铜中Cu（Ⅱ）-EDTA电还原机理

Mechanism of Cu (ⅱ) - EDTA Electroreduction in Electroless Copper Plating

Al2O3颗粒表面镀铜铁基摩擦材料的研究

Research on Frictional Material Prepared by Copper-coating Al_2O_3 Particles on Iron-based

用于MEMS的单晶硅上无电镀铜、镀镍工艺

Electroless Copper and Nickel Plating on Single-Crystal Silicon for MEMS Applications

均匀设计法在Al2O3粉末超声化学镀铜工艺中的应用

Application of Uniform Design in Electroless Copper Plating on Al_2O_3 Powder under Ultrasonic Irradiation

ABS塑料化学镀铜动力学参数的研究

Research on dynamic parameters of Electroless Cu deposit on ABS plastics

Z型光亮剂酸性镀铜工艺及机理研究

Study on Technique and Electrochemical Mechanism of Acidic Copper Electroplating of Z-type Brightener

PET塑料化学镀铜

Electroless Copper Plating on PET Plastics

Cu（Ⅱ）-EDTA-HCHO化学镀铜中阴、阳极反应的控制程度

The control Degree of Cathodic and Anodic Reactions is Electroless Copper Plating System of Cu (ⅱ) - EDTA-HCHO

ABS塑料低温快速化学镀铜的研究

Study on electroless copper plating at low temperature and rapid rate for ABS plastic

PCB高稳定性化学镀铜工艺研究

A Study on the Technique of Electroless Cu Deposition on PCB With High Stability

纳米Al2O（3p）化学镀铜复合粉末的烧结致密化

Sintering densification of Cu / Al_2O_ ( 3p ) nano-composite powders by electroless copper plating

印刷电路板化学镀铜液回收EDTA的研究

The Recovery of EDTA in Waste PCB Chemical-copper Solution

采用真空蒸发、溅射和化学镀铜的方法分别对研制的PTFE基复合介质进行了金属化处理。

PTFE based dielectric is metallized by vacuum vaporing , vacuum sputtering and chemical plating respectively .

本文研究了ABS塑料、聚氯乙烯、聚酯薄膜的自催化镀铜工艺。

Process of copper autocatalytic plating on ABS plastic , polyvinyl chloride , polyester film have been studied in this investigation .

用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。

Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent .

本文采用不加压烧结粉末冶金技术，针对化学镀方法制备的纳米Al2O（3（P））化学镀铜复合粉体的烧结致密化特性进行了系统的研究；

In the paper the densification properties of Cu-coated nano-Al2O3 ( p ) compounds prepared by electroless copper plating have been researched by the method of pressureless sintering .

利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。

Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer .

用SEM观察经角鲨烯模型试验处理过的镀铜钢丝，发现有机钴盐可使镀铜钢丝表面生成许多小颗粒。

The SEM photo shows that much more grains exist on the surface of the brass-plated steel cord treated with squalene solution containing organic cobalt complex .

酒石酸钾钠和EDTA·2Na盐化学镀铜体系

Electroless copper plating system of potassium sodium tartrate and EDTA · 2Na

铁电极上HEDP镀铜的电化学行为

Electrochemical behavior of copper deposit on iron electrode in HEDP bath

本论文主要是对PET薄膜进行臭氧处理，然后再接枝以获得较好的亲水性和吸附活性，从而使化学镀铜反应顺利进行。

Ozone treatment and grafting of PET film to achieve good activity which makes the reaction of electroless cooper plating takes place smoothly is the main purpose of the paper .

在Cu（Ⅱ）-EDTA-HCHO的化学镀铜液中，阴极过程受电化学步骤或电化学步骤与异相表面化学转化步骤共同控制。

The cathodic reaction process of electroless copper plating in Cu (ⅱ) - EDTA-HCHO solution is controlled by either electrochemical step or by the combination of electrochemical and surface chemical reaction steps .

系统研究了以三乙醇胺（TEA）为主络合剂、EDTA·2Na盐为辅络合剂的二次镀铜体系。

Secondary electroless copper plating system of triethanolamine ( TEA ) and EDTA · 2Na dual-chelating-agent is researched in the paper .

用化学氧化及苯并三氮唑（BTA）钝化处理的方法来提高化学镀铜层的表面抗氧化、耐腐蚀和耐磨性能。

Chemical oxidation and BTA passivation were used to improve the properties of electroless copper deposits .

Ni-P和Ni-Mo-P的电沉积采用氨性柠檬酸盐镀液，铜镀层采用最简单的酸性镀铜镀液。

Ni-P and Ni-Mo-P alloys were electrodeposited in ammoniac citrate electrolyte and copper layer in acidic sulphate electrolyte , respectively .

通过腐蚀实验，对原有BTA钝化液进行改进，研制出新的镀铜焊丝的钝化剂。

Through corrosion experiment , a new kind of passivator has been studied by improving original BTA passivating liquid .

三乙醇胺和EDTA·2Na盐双络合体系快速化学镀铜工艺研究

Study on Electroless Copper Plating Technology of High Plating Rate in Triethanolamine and EDTA · 2Na Dual-chelating-agent System