研磨盘

可以采用修盘方式修整研磨盘。

The machine has a conditioning mode for lapping plate self-reconditioning .

用于超精密加工的合金铸铁研磨盘

A Lapping Plate Made of Alloy Cast Iron for Superfine Machine Work

对修正环形抛光机CMP过程进行运动分析，给出研磨盘上一点相对于工件的速度矢量与轨迹方程。

Carried through kinematic analysis for napping the CMP process of ring polishing machine , and presented pace vector and track equation about one point relative to examination piece on polishing pad .

咖啡豆磨具用玻璃杯光学玻璃平面研磨盘

Cup , of glass , for coffee mill flat optical tool

研磨盘静平衡误差分析及控制

Control and Analysis on static balancing errors for grounding plate

厚断面大型研磨盘的铸造技术

Casting Technology of Thick - section and Large-dimensional Grinding Plat

研磨盘焊接工艺及设备研究

Study on Technology and Equipment of Grinding Disk Welding

全面论述研磨盘生产的最新技术。

The manufacturing technology of Grinding Disc was introduced .

通过去除研磨盘和虑油器排干油。

Drain oil by removing pan and filter .

简要分析了研磨盘沟槽形状对钢球加工质量的影响。

The influence of the grinding plate groove shape on steel ball processing quality is briefly analyzed .

光学玻璃平面研磨盘直翼推进器盘面直径

Flat optical tool blade-circle diameter

本文介绍了研磨盘的焊接方法和次极整流焊机的应用方法。

The welding method of Grinding Disk by the second pole rectifier welder is described in this article .

采用田口试验法来获取陶瓷球双自转研磨盘研磨方式的最佳工艺参数，以及各参数对研磨指标的贡献率。

This paper focuses on the application of Taguchi method to optimize the technique parameters to lap ceramic ball .

试件与研磨盘间的流体润滑特性表明，圆平动平面研磨有利于提高表面质量和材料去除率。

The hydrodynamic lubrication characteristics be-tween the wafer and pad are shown to illustrate that circular-translational-grinding facilitates increasing material removal rate .

论文采用单因素方法，对弹性浮动加工系统中研磨盘的转速、弹性系数对加工的表面质量的影响进行了研究。

In this paper , the effects of lapping speed and elastic coefficient on the quality of diamond surface are discussed .

现有的双自转研磨盘球体研磨机都采用滚动轴承，具有摩擦磨损大、精度寿命有限、寿命分布离散、减振性差等固有缺点。

The existing dual-plate lapping machine uses rolling bearing , so it has following inherent shortcomings , the big friction and wear , the limited precision life , discrete life distribution , and poor vibration damping .

硬磁盘基片研磨中修盘工艺磨削轨迹分析及优化

On the Analysis and Optimization of Wear Track of Grinding Stone Dressing Process for Computer Hard Drive Disk Substrate

本文金刚石的加工方式为弹性浮动研磨，研磨盘安装在一个弹性垫上，金刚石被夹具固定在一个弹性梁上，二者通过一种耦合的关系发生作用对金刚石实现加工。

The grinding plate is installed on an elastic mat ; diamond is fixed on an elastic beam clamp , both through a coupling relationship works on implementation of diamond processing .

蓝宝石衬底研磨加工中研磨盘材质的影响

Effect of Plate Materials on Sapphire Wafer Lapping Process

同时建立球体运动的力和力矩的动态平衡方程，分析研磨压力、研磨盘转速和研磨条件对球体滚动、滑动运动状态的影响。

The dynamic equilibrium equations of force and torque have been established , and the impact of lapping pressure , plate speed and lapping conditions to the movement state of the balls , which are rolling and sliding , is analysed .

针对玻屏研磨机构特点及研磨盘生成技术现状，运用计算机仿真技术，模拟现实条件下研磨机构的运动情况；

In view of the characteristics of abraders and the status quo of the generating technology for abrasive disk , this paper employs computer emulating techniques to simulate the actual moving conditions of abrasive mechanism ;

对修正环形抛光机定偏心和不定偏心平面研磨进行了运动分析，给出了研磨盘上一点相对于工件的速度矢量与轨迹方程，讨论了研磨盘上不同位置的点的相对轨迹。

Kinematic analysis for certain and uncertain eccentricity plane lapping processes with the ring polishing machine were studied and compared , pace vector and track equation about one point relative to examination piece on polishing pad were presented .

设计了能够在研磨机床上拆卸的车削装置，减少了研磨盘修整后的安装误差，有利于提高钢球的加工效率和精度。

An automatic turning devices is designed , reducing installation error when the grinding plate is trued and dressed , which improves the machining accuracy .

接着分析行星式平面研磨机的运动轨迹及其对加工表面质量、研磨效率、研磨盘磨损均匀性的影响；

The movement locus and its effects on surface quality , productivity , and the abrasion uniformity of the abrasive disk were analyzed .

结果表明：固结磨料研磨加工时的去除速率不仅与工件的材质有关，还与固结磨料研磨盘的结构与加工参数相关；

The results showed that the material removal rate is related to material of parts , structure of pad and machining parameters .

提出了一种新的不定偏心平面研磨方式，主动驱动工件使其在绕自身回转轴自转的同时，绕垂直于研磨盘表面的轴线公转。

A novel mode of uncertain eccentricity plane lapping is presented , while the workpiece rotates about its own axis , it 's revoluting about the axis that is perpendicular to the abrasive disk .