电镀技术

系统地介绍了电子封装中所涉及的各种电子电镀技术，并阐述了IC引线框架及无铅化电镀技术方面的应用情况、存在问题及今后的发展趋势。

Various electronic electroplating technology in electronic packaging were systematically discussed . Moreover , the applications , existing problems and development trends of IC lead-frame and lead-free electroplating technology were illustrated .

本研究工作采用复合电镀技术，制备了Pb-WC复合电极，并将其用于酸性溶液（尤其是H2SO4）中氢离子阴极还原反应。

In the present study , Pb-WC composite electrode was prepared by using technique of composite electroplating and was used for the cathodic reduction reaction of hydrogen ions in cid ( especially in H_2SO_4 ) solution .

为了设计出导电的Ni微变截面悬臂梁，采用了基于成熟的电镀技术的微电铸工艺。

Micro-electroplating based on the mature electrodepositing technology was applied to design conductive Ni micro-cantilever with different cross-section .

首次将复合电镀技术应用于圆型电路管壳，采用由暗镍Ni-Al2O3酸性脉冲金组成的新镀层体系代替传统的镀层。

The compositive plating technique is first applied to the circle pattern circuit . The new plating system consists of dark nickel , Ni-Al2O3 compositive plating and acid pulse gold plating .

采用脉冲电镀技术制备了纳米孪晶镍（NT）镀层，并以腐蚀性能为标准，应用正交实验设计优化了脉冲电镀参数。

A nickel coating with nano-scale twins ( NT ) was synthesized by using pulsed electrodeposition technique . And pulsed electrodeposition technique was optimized by orthogonal test , with corrosion resistance in solutions containing chloride ions as inspecting criterion .

本文简述了无铅焊技术实施在材料技术、无铅化电镀技术、无铅化PCB技术、无铅化电子组装技术以及无铅焊产品在可靠性研究方面所面临的课题。

This paper describes in brief the challenges that Pb-free soldering technology implemented in materials technology , Pb-free plating technology , Pb-free PCB technology , Pb-free electronic assembly technology and Pb-free soldering products in terms of reliability research are faced with .

本论文将电镀技术应用于传统的等离子、低气压等离子以及爆炸喷涂法喷制的Al2O3涂层，用扁平粒子间平均结合率和扁平粒子的平均厚度为结构参数定量地评价涂层结构。

In the present paper , the electroplating technique is applied to Al2O3 coatings sprayed by conventional plasma spraying , low pressure plasma spraying and detonation gun spraying to characterize quantitatively the coating structure using such structural parameters as mean lamellar bonding ratio and mean thickness of flattened particles .

并且综述了塑料电镀技术在各方面的应用及其现状。

It relies on the use of conductive macromolecule polymer materials ;

凸点芯片倒装焊接技术电镀技术在凸点制备工艺中的应用

Flip-chip Bonding Technology Application of Electroplating Technology to Solder Bumping Formation

汽车减振器杆高速硬铬电镀技术

High Speed Hard Chromium Electroplating Technology for Automotive Shock Absorber Rod

连续高速电镀技术在集成电路引线框架生产中的应用

Application of continuous high speed plating technology in IC lead frame production

羟基丙烷磺酸内酯作为一种重要的有机中间体，在电镀技术中具有重要作用，为此，通过对多条合成路径的对比，探讨了其最佳合成工艺。

Hydroxyl propane sulfone is an important organic intermediate for electroplating technology .

防护性电镀技术在汽车生产中的应用与发展

Application and Development of Protective Electro-Plating Technology in Automotive Production

铝合金压铸件电镀技术的进展

Advances in Technigue of Electroplating for Die-Catings of Aluminium Alloys

用低温金属电镀技术制造与封装的惯性微型电学开关

Fabrication and Packaging of an Inertia Electrical Micro-Switch Using Low Temperature Metal-Electroplating Technology

电子元器件可焊镀层电镀技术现状及发展动态

Present status & trends of solderable electroplating on electronics

另外还讨论了直接电镀技术在解决孔壁空洞上的应用。

Besides the application of direct plating was also discussed in this paper .

天津市电镀技术委员会及其主要活动

Tianjin Electroplating Technical Committee and Its Major Activities

国内外电镀技术发展趋势

Technical Trends of Electroplating At Home And Abroad

简单介绍了局部电镀技术的原理及方法。

Principle and methods of local spot plating for1C lead frame were briefly introduced .

最新的电镀技术及方案定制产品范围广。

Latest Electroplating Technique and MethodCustomized Product Range .

开发无铅化纯锡电镀技术必须首先解决锡须问题。

Whisker problem must be firstly solved in developing a lead-free pure tin electroplating process .

镍陶瓷电镀技术在摩托车上的应用

Application of Nickle Ceramic Electroplating to Motorcycle

镁合金及其表面电镀技术

Electroplating Technology for Surface of Magnesium Alloy

电子封装中电镀技术的应用

Applications of electroplating technology in electronic packaging

锌基合金压铸件的电镀技术

Electroplating Technology for Zinc Alloy Die Castings

日本电镀技术的发展

Development of Electroplating Technology in Japan

缓蚀剂在电镀技术中的应用

Applications of Corrosion Inhibitors in Electroplating

摩托车零件的电镀技术

Electroplating Technology of Motorcycle Parts

本研究所成立于1994年，主要任务是电镀技术工艺的研究和开发。

The Institute was established in1994 , the main task is to electroplating techniques of research and development .