回流焊

最明显的是，使用无铅锡膏必须提高回流焊温度。

The most obvious is the necessity for increased reflow temperature .

如何从热容的思想建立回流焊温度曲线的方法？

How to build up methods of thermal reflow profile in the idea of thermal capacity .

基于VB的回流焊温度测试系统软件设计

Software design of reflow soldering temperature measurement system based on VB

广泛应用于线材的热压焊、焊锡焊接的回流焊，IC贴片。

HOT BARThe hot wire is widely used in welding , solder reflow soldering .

回流焊中常见的缺陷&锡珠无铅PCB组件再流焊焊接工艺的热变形仿真分析

The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process

SiP器件回流焊时湿热应力的分析

Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering

采用PLC和温度传感器完成对回流焊温度的现场检测和控制，达到了工艺要求。

In the end , PLC and temperature sensors are used to complete the reflow soldering temperature control and detection .

在过回流焊时有无同CAD或程式数据相联系的软件工具来帮助实现元件的确认与返工？

Is there a point and click software tool post reflow which is linked to CAD or program data to facilitate component identification for rework ?

论文的创新之处和解决的关键问题：1：通过大量的综合试验确定了适合回流焊系统的PID参数整定规则2：对基于微控制器的控制系统进行了电磁兼容性研究。

The innovation and key problem to this thesis is to ascertain PID tunning rules by a great deal of experiments , study syetem 's EMC problems .

回流焊温度曲线为回流焊参数设定值、PCB产品特性等综合输出效应，其需求呈现多样性与高复杂度。

Reflow soldering profile for the parameter values , PCB product features such as integrated output effect , showing diversity of their needs and high complexity .

这有可能在芯片粘接剂/基板界面出现分层。本文最后对PoP模块进行了回流焊载荷下的可靠性分析。

Die attachment / substrate interface delamination tended to occur with high risk in reflow step . Finally , the reliability analysis was simulated for PoP under the reflow load .

传统的波峰焊存在漏焊、焊点拉尖、PCB变形等问题，回流焊存在温度过高，且两者成本都很高。

Conventional wave soldering exist leak welding , solder joint icicles , PCB deformation , etc. Reflow soldering temperature is too high , and both of them have a high cost .

回流焊过程温度、潮湿和蒸汽压力对PBGA分层的影响

Effect of Temperature , Moisture and Vapor Pressure on Delamination in a PBGA During Reflow Soldering Process

随着Cu含量的增加，回流焊后IMC层厚度逐渐变薄，IMC的晶粒尺寸逐渐增大。

With the increase of Cu content in these low-Ag Pb-free solders , the thickness of IMC layer decrease obviously after reflowing , and the sizes of grains become larger .

本文主要对表面安装型塑封体（如SOP、PLCC、PQFP、PBGA等）在回流焊时吸湿开裂机理以及相应对策等进行讨论分析。

This paper is mostly studying and analyzing moisture-induced cracking of surface mount packages ( SOP , PLCC , PQFP , PBGA etc. ) under specified reflow soldering conditions , and put forward some corresponding countermeasures .

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

回流焊工艺参数对温度曲线的影响

Effect of parameters of reflow oven on the Reflow Profile

适合无铅回流焊的片式铝电解电容器研制

Study on SMD Aluminum Electrolytic Capacitors Resisting Lead-free Reflow Solder

请遵守产品目录中的回流焊条件。

Please follow " Reflow Soldering Conditions " in catalogue .

在回流焊形成的合金层中也有一些微孔和裂缝。

There are also some micropores and microcracks in the reflowed alloy .

贴片灯珠，全自动化回流焊生产；

SMD lamp beads , manufactured through full automatic reflow soldering line .

适用于回流焊，流动和铁焊接过程。

Suitable for reflow , flow and iron solderings .

无铅回流焊冷却速率对焊点质量的影响实施倒装芯片的组装

Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering

根据插件焊接质量的要求，按照回流焊工艺设计印刷模板。

Design stencil according to requirement of inserter soldering quality and reflow soldering technology .

焊锡粉品质对回流焊时焊料球产生的影响

Effect of Solder Powder Character on Inducing Solder Ball in Course of Refluence Soldering

插件回流焊印刷模板的设计

Design of Insert Reflow Soldering Print Stencil

回流焊工艺探讨

Probe into Reflow Soldering Process

通孔回流焊技术的研究

The Research of Through-hole Reflow

AOI/AXI的检验方法包括焊接点的检验，是否用于回流焊元件检测？

Are AOI / AXI complementary methods , which include solder joint inspection , used for all reflowed parts ?

回流焊输出之板是否至少抽样检查板的置件精度，有无少件和不良焊点？

Are outputted boards at least sample inspected pre reflow for placement , missing components , and solder defects ?