制造工艺
- manufacturing process;manufacturing engineering
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300MW锅炉高强度螺栓结构构架制造工艺
Manufacturing Engineering of High Strength Bolt Steel Structure for 300 MW Utility Boiler
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本文介绍了TAB器件及其制造工艺,通过讲述ACF特性,细致地阐述了TABOLB的工艺原理及参数设定方法,并对工艺中容易出现的不良现象进行了分析。
This paper has introduced TAB device and manufacturing engineering , with telling ACF characteristic , expatiated on TAB OLB craft principle , the method of establishing correlative parameter , and has analyzed to the typical problem in the craft .
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蜗杆形珩磨轮CAD及其制造工艺研究
Research on Manufacture Technics and CAD of Worm-type Honing Wheel
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可广泛推广应用于IC的制造工艺中。
Can be widely appled to IC manufacture field more and more .
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无铅互连界面及RFID制造工艺
Interfacial Issues of Lead - free Interconnection and RFID Fabrication
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介绍一种基于MEMS技术的微型电磁继电器的制造工艺和仿真过程。
The fabrication and simulation of an electromagnetic microrelay based on MEMS technology are presented .
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飞机制造工艺路线分工计划及BOM管理系统研究
Research of manufacturing process route planning and BOM management system ori-ented airplane manufacturing venture
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本论文主要分为以下部分:低压集成电路制造工艺中的ESD问题。
Related contents and conclusions as follows : ESD issues in low voltage CMOS processes .
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而且由于当今的LCD制造工艺已经非常成熟,其几何精度和视觉效果也相当优秀。
Moreover , because of the sophisticated manufacture technology , the geometrical precision and visual effect of LCD have been excellent too .
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集成电路制造工艺已经通过了深亚微米极限,使得IC设计者可以在单个芯片上集成上千万个晶体管,集成电路进入了片上系统(SOC)王国。
As silicon technology has crossed the deep - submicron threshold , we can design tens of millions of transistors on a single chip .
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传统的PZT基压电陶瓷因具有成熟的制造工艺和优异的压电性能,因而被大量采用。
Traditional PZT-based piezoelectric ceramics have been widely used for the sake of mature manufacturing process and excellent piezoelectric properties .
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本文仅就应用真空技术的角度,描述了有机EL元件制造工艺和有机EL生产系统。
The manufacturing processes and production systems for organic EL elements are described at the viewpoint of the application of vacuum technology .
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作为产品生产过程中的信息源,制造工艺资源在CAD/CAPP集成系统中起着关键性的作用。
Being the source of information in the process of product , the process resources of manufacturing plays a key role in the integrated CAD / CAPP system .
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随着IC制造工艺的快速发展,在单一芯片上可以实现完整的系统功能,SoC(Systemonchip)时代已经来临。
With the rapid development of silicon technology , all the functions of a system now can be integrated onto a single chip , time of SoC ( System on Chip ) comes .
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有关低阻PTC陶瓷材料的研究,在材料阻成、制造工艺与原材料选择等诸方面均取得了新进展。
New progress in some respects of material composition , manufacturing process , raw material selection and the others has been made .
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随着集成电路制造工艺水平和计算机体系结构水平的不断进步,处理器设计技术得到迅速发展,SoC的时代已经来临。
With the development of Integrated Circuit Manufacture and Architecture design , processor design has been greatly improved . The time of System on Chip is coming .
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ALA转子无刷双馈风力发电机的参数计算方法与转子制造工艺探讨
Study on the parameter calculation method and the rotor craftwork of the doubly-fed brushless wind-power generator with ALA Rotor
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应用AOI控制制造工艺质量
Application of AOI in Quality Process Control
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K(18DA)型煤炭漏斗车中梁制造工艺分析
Analysis of the Manufacture Technology for the Center Sill of K_ ( 18DA ) Coal Hopper Car
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概述了一次层压型聚酰亚胺多层FPC的特征、制造工艺和应用。
This paper describes the characteristic , manufacturing process and application of polyimide multilayer FPC laminated in gang operation .
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采用一种自对准制造工艺和倒装芯片的装配技术,研制出GaN基蓝光大功率发光二极管(1mm×1mm)。
The technologies of serf-aligning and flip-chip are adopted to develop GaN based high-power blue light emission diode ( 1mmx1mm ) .
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XN(17A)平车车体制造工艺
Manufacturing the body of XN_ ( 17A ) flat car
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IC制造工艺的发展,持续增加着VLSI电路的集成密度,亦日益加大了电路故障测试的复杂性和困难度。
As the density of VLSI circuits increases and the technique of IC manufacturing develops , fault testing on digital integrated circuits becomes more and more complex and difficult to implement .
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100t矿石/矿粉/钢材运输专用车中梁制造工艺
Manufacture Technology for Center Sills of the 100 t Special Wagons for Transport of Ore / Mineral Powder / Steel
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秦沈客运专线24m箱梁制造工艺试验
Tests of Precasting Procedures for 24-m Box Girders to be Used on Qinhuangdao & Shenyang Special Lines of Passenger Trains
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简介了LN7210智能GPIB接口控制器的主要功能、制造工艺以及测试技术。
This paper introduces the main function and technology of LN7210 intelligent GPIB controller briefly .
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现有MEMS制造工艺难于同时满足既能加工真三维微结构又能与集成电路工艺兼容的要求,严重阻碍了MEMS产业化的进一步快速发展。先进制造技术之ICMEMS制造技术及其发展趋势(续前)
Currently , the MEMS fabrication technology can 't meet the needs of 3-D structure fabrication and compatibility with IC fabrication simultaneously ; thus the development of MEMS industrialization has been impeded to a certain extent .
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在模具制造工艺设计中采用CAPP技术,不仅可以改善设计质量、提高设计效率,而且可以提高设计的智能化、自动化程度,降低对工艺设计人员专业水平的要求。
The use of CAPP method for mould process planning can improve the quality and efficiency of process planning , and more over , it can improve the intelligence and automation degree of process planning .
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x射线光刻非常适合用于深亚微米T形栅的制作,这是因为它的高分辨率、大的曝光视场和高的生产效率足以满足MMIC制造工艺的要求。
X-ray lithography is very suited for the fabrication of deep-submicron T-shaped gate , because its combination of high resolution , large exposure window and high throughout satisfies the requirements for MMIC manufacturing process .
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随着集成电路制造工艺的进步以及应用需求的增长,未来SoC系统将变得非常复杂,单个芯片上将集成数百个处理核心。
With the development of IC fabrication technology and the increase of application requirements , SoC systems in the future will become even more complex and integrate hundreds of processing cores into a single silicon chip .