引线键合

基于FPGA的引线键合超声电源的研究

Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA

面向MEMS自动引线键合的显微视觉系统研究

Research on Micro Vision System for Automatic MEMS Wire Bonding

平整度对细Al丝超声引线键合强度的影响

Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength

IC引线键合引线轮廓成形仿真研究

Simulation Study of Wire Loop Profiling in IC Wire bonding

RFMEMS引线键合的射频性能和等效电路研究

On RF Characterization and Modeling of RF MEMS Bonding Wire Interconnection

随着SAW器件向小型化、轻型化的发展，传统的引线键合技术已对其形成严重制约。

As SAW filters becoming smaller and lighter , the general wire bond has imposed restrictions on its development .

IC封装中引线键合互连特性分析

Character Analysis of Bond-Wire in IC Package

超声引线键合PZT驱动信号采集分析系统

A PZT driver signal acquisition and analysis system for ultrasonic wire bonding

为进一步提高热超声引线键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。

To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding , the design scheme based on FPGA was proposed .

IC引线键合中，键合头的运动轨迹决定着引线轮廓的形状和内部张力，影响着封装的密集度和稳定性。

Wire loop profile and its strain , which greatly affect the density and stability of IC packaging , are determined by the capillary trajectory .

超细间距引线键合将部分参数推向其物理极限值，要求更小直径的金球（FreeAirBall）和键合球（bondedball），所采用的金线直径更小。

Ultra-fine-pitch wire bonding may make some parameters to their physics extreme , require the free air ball and bonded ball of smaller diameter and the diameter of gold line adopted .

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

The methods of3D interconnection can be classified into the wire bonding , flip chip , through silicon via ( TSV ) and film wire technology , whose advantages and disadvantages are analyzed .

随着LED行业的快速发展，对半导体后封装设备的性能也提出了越来越高的要求，用于半导体后封装中引线键合机的超声键合系统的工作性能成了关键因素之一。

With the rapid development of LED industry , it requires better performance of semiconductor-sealing-packing equipment . It is key factor that serviceability of ultrasonic transducer used on bonding machine is good or bad .

本文将有限元法仿真、BP神经网络和遗传算法等现代计算方法综合运用到IC引线键合头的轨迹规划中，提出了系统高效的轨迹规划方法。

This paper presents an integrated method in which finite element , BP neural network , and genetic algorithms are used to optimize the parameters for systemic and efficient trajectory planning .

根据超声引线键合实验平台电路结构，设计了PZT（压电陶瓷）驱动信号采集电路。

According to the circuit of ultrasonic wire bonding experiment platform , a piezoelectric transducer ( PZT ) driver signal acquisition circuit was designed .

随着引线键合技术向着细密化、高精度的方向发展，视觉系统已经成为影响IC封装精度的重要因素之一。

With the requirements of high accuracy and high speed in wire bonding , machine vision positioning system has become one of important factors which influence the quality of IC packaging .

实验结果显示，基于遗传算法的OTSU法和基于灰度-梯度直方图的二维OTSU快速实现方法在速度和精度上均可满足引线键合机的工作需求。

Results showed that both the method based on GA and OTSU and the method based on 2-D OTSU could meet the requirement of the wire bonder .

晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。

Wafer chip scale packaging ( WCSP ) eliminates conventional packaging steps such as die bonding , wire bonding , and die level flip chip attach processes .

本文介绍了一台自动引线键合装置。

In this paper , an automatic wire bonder is presented .

键合时间对粗铝丝超声引线键合强度的影响

Effect of bonding time on thick aluminum wire wedge bonding strength

基于计算机视觉的引线键合机定位平台的运动学标定

Vision-Based Kinematic Calibration of the X-Y Table for a Wire Bonder

超声振动在引线键合系统中的传播仿真与研究

Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System

双键合点破坏性引线键合拉力试验的测量误差分析

Analysis of Error in Measurement During Destructive Double Bond Pull Test

基于永磁直线电机引线键合系统的设计

The Design of Wire Bonding Based on Permanent Magnet Linear Motor

对影响内引线键合可靠性的因素的分析与对策

Analysis and Research of the Effect on the Wire Bonding Reliability

全自动引线键合机系统软件分析与设计

Software Analysis and Design of the Fully Automatic Gold Wire Bonder

全自动引线键合机上的图像视觉系统

The Image Vision System of the Full Automatic Wire Bonder

集成电路内引线键合工艺材料失效机制及可靠性

Wire Bonding for IC Technology Materials Failure Mechanism and Reliability

提高引线键合机超声系统性能的若干因素的分析

Analysis of Some Factors Improving Performance of Ultrasonic System in Wire Bonder

微波电路引线键合质量的影响因素分析

Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit