陶瓷封装

提出并设计完成了金属铠装结构的FBG温度传感器和类陶瓷封装结构的FBG温度传感器。

We have designed and fabricated metal armoured FBG temperature sensor and ceramic FBG temperature sensor .

AlN陶瓷封装的研究现状

Present Status of AlN Ceramic Package

因而在陶瓷封装中，采用厚度大于4mm的、含Co15%左右的Ni-Co合金，代替Ni作为底镀层是可行的。

Ni-Co alloy of 4 mm in thickness and 15 wt % Co content is recommended to replace Ni as an underlayer in ceramic packages .

为了使用NiCo合金代替Ni作为陶瓷封装电镀金层的底镀层以提高它的抗高温老化能力，系统地研究了从氨基磺酸盐镀液中获得低Co含量NiCo合金镀层的规律。

Using Ni-Co alloy to substitute Ni as the sublayer of gold plating for ceramic package is an important way to improve its resistance to high-temperature . Ni-Co alloy electroplating with low Co content from sulfamate bath were systematically studied .

并专门设计了一种用于压电陶瓷封装夹持的结构。

A piezoelectric ceramic package and clamping structure was designed specially .

金属陶瓷封装耐振型光电倍增管的研制

The Research on a metal and Porcelain encapsulation rugged type Photomultiplier Tube

一种大腔体陶瓷封装结构的研制

Study on a Ceramic Packaging Structure with Large Inner Cavity

该磁控管采用金属陶瓷封装，装有永磁体。

The generator represents magnetron , packaged with constant magnets in ceramic-metal execution .

高密度陶瓷封装外壳散热问题探讨

Investigation on High Density Ceramic Packages Heat Disspation Issues

大腔体高密度高可靠陶瓷封装技术研究

The Research Study of Technology in High Density / Big Cavity Ceramic Packaging

多层陶瓷封装外壳的微波设计

Microwave Design in Multilayer Ceramic Package

微电子陶瓷封装的金属化技术

Metallization Technologies for Micro-electronic Ceramic Packaging

分别采用金属和陶瓷封装工艺，研制了单尾纤和双尾纤两种不同的传感器结构。

Designs with one or two optical fiber pigtails , by using metal and ceramics packaging technologies were studied respectively .

简述了集成电路陶瓷封装内部水汽含量的不稳定性，主要是由粘接材料导电胶在高温下分解释放出的水汽所造成的。

The unstability for steam content in the sealed devices is described , it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature .

模拟结果显示，该封装后的传感器的温度场与未封装传感器相似，证明陶瓷封装结构是可行的；

The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one , which proves the feasibility of this packaging scheme .

利用扫描电镜观察了陶瓷封装电容器结构和失效形式，并利用能谱仪对金属电极、陶瓷电介质等进行了成分分析。

The structure and invalidation pattern of the ceramic encapsulation capacitor were analyzed by means of scanning electron microscopy . The composition of metal electrode and ceramic medium layer was studied by the energy spectrometer .

尤其对高可靠、高密度多层陶瓷封装技术以及新型陶瓷材料作了详细评述，并对今后我所封装方面的研制、开发工作提出了建议和设想。

Especially , the technology of high reliability , high density multilayer ceramic package and new ceramic materials are reviewed . In addition , the author also offers some suggestions on the future packaging development in our institute .

陶瓷阵列封装的两种形式及其接头可靠性

Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability

本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。

This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC .

本文利用X射线对3D&MCM中的BGA焊点、基板和隔板之间的焊料凸点、叠层基板间的垂直互连和陶瓷-金属封装等进行检测；

The paper describes that the BGA solder joint , the solder bumps between 2D-MCM and spacer board , vertical interconnect between 2D-MCM layers and ceramic-metal package are inspected with X-ray .

陶瓷&金属封装中的二次金属化技术

The Second Metallizing of Ceramic to metal seal

该设备已应用于金属、陶瓷管壳封装技术及其相关工艺的研究。

In addition , this equipment has applied in the researcher of shell package and process technology for metallic shells .

这种新型材料正被应用于从电阻、热电隅及变压器、电容的密封端水泥绝缘子及点火器到金属玻璃及其它陶瓷制品的封装及涂覆。

The new material is being used to pot and coat electric resistors , thermocouples and transformers ; seal ends of capacitors ; and cement insulators and ignitors to metals , glass and other ceramics .

描述了一个基于低温共烧陶瓷（LTCC）封装技术的微波振荡器的设计和制作。

This paper describes the design and implementation of a microwave oscillator based on Low-temperature Co-fired Ceramic ( LTCC ) packaging .

封闭式机械通风集装箱陶瓷双列直插式封装

Closed container mechanically ventilated ceramic dual in-line package

这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。

The two chips are mounted on a ceramic substrate , and then hermetically sealed in a ceramic surface mount package .

Si芯片贴装于陶瓷基板可以很好的取代它，既可以提高组装密度，焊点寿命也比前者提高了6倍。陶瓷封装对陶瓷基板搭配是其中可靠性最好的，它的焊点寿命最长。

Sticking the Si chip to the ceramic base plate can replace the former , because it not only raise the density of assembling , but also life-span of solder joints is prolonged to 6 times than the former ;