阻焊层
- 网络Solder resist layer;Solder Mask;solder mask layer;Top/Bottom Solder
阻焊层-
预烘：预烘的目的是使阻焊层进行热固化，有利与曝光一步的处理。
Tack Dry : evaporate the mask solvents and cure the mask sufficiently to be handled in exposure step .
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其方法是在印制板完成阻焊、字符层的印刷，并经电检之后，通过表面浸渍在裸铜的贴片位或通孔内形成一种耐热性的有机可焊性膜层。
The organic solderability film is formed through surface immersion on bare Cu pad or in through hole after printing of soldering preventing and letter and checking of electricity .