软钎料

ICP-AES测定软钎料中杂质铅和铁

Determination of Impurity Lead and Iron in Soft Solder by ICP-AES

陀螺仪壳体钎焊软钎料润湿性研究

Study on Wettability of Soft Solder in Gyro - Housing Soldering

通过酸度溶解试验、干扰实验等，建立了ICP-AES测定软钎料中杂质铅和铁的分析方法。

A method was established for determination of impurity lead and iron in soft solder alloy by ICP-AES .

Zn对Sn-Ag-Bi系软钎料钎焊性能影响的研究

Effect of Zn on the Solderability of the Sn-Ag-Bi Solders

高强度ZA合金软钎料的研制

Research on High - strength ZA Alloy Solders

Sn-Zn系电子无铅软钎料湿润性能的研究

Wettability of Sn-Zn System Lead-free Electronic Solders

故在Sn-Ag近共晶无铅软钎料中Bi的添加量，应加以适当的控制。

Therefore , the Bi content should be limited to some degree in the research and development of the new Sn-Ag lead-free solders .

Sn-Ag系电子无铅软钎料的超电势研究

Overpotential Research of Sn-Ag System Electronic Solders

结果表明，用研制的新型高强软钎料钎焊高强度ZA合金获得的钎焊接头在界面区局部有交互结晶产生；

The results show that interactive crystallization exists in the interfacial region by using a new developed high strength soldering filler metal .

ZL102合金用低温软钎料的研究

Study on Solder of Low Temperature for ZL 102

讨论了电子软钎料的钎焊性能及其影响因素，并采用铺张面积法对Sn-Zn-Ag系钎料钎焊性能进行评估。

The solderability of electronic solders and effect of some factor on the solder ability were discussed . And the test method of spreading areas was used to evaluate the solderability of the Sn-Zn-Ag family of solder .

基于环保和可持续发展，本文概述了SnAg、SnZn、SnBi、SnCu、SnSb等系列Sn基无铅软钎料研究成果，分析了电子工业用无铅钎料的可靠性问题。

Considering environmental protections and sustainable development , the research conclusions of Sn-based Lead-free solders series ( such as SnAg 、 SnZn 、 SnBi 、 SnCu 、 SnSb et al ) are illustrated in this paper . Reliability of electronic Lead-Free Solders was also analyzed .

无铅软钎料国内外的研究动态与发展趋势

Research and development trend of lead-free solder alloy at home and abroad

电子表面封装无铅软钎料的研制

The Research and Development of Pb-free Solders for Electronic Surface Mount Technology

多元无铅软钎料的计算机优化设计

Optimal design of multi-element lead-free soft solder with computer

无铅软钎料的研究现状与展望

Current Status & Prospect Of Lead-Free Solder Alloy

无铅软钎料的新进展

New Development of Lead-free Solders

引入了快冷锡基软钎料的浸润性模型，并进行了计算处理。

A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed .

软钎焊钎料的最新发展动态

The New Development in Solder Alloys