表面安装

一种新型金属表面安装外壳的设计与制作

Design and Making Process for a New Type of Metal SMT Package

国外表面安装技术标准

International Standards for SMT

表面安装PCB板的测试方法及可测性设计

Test Technique and Testability Design of Surface Mount Technology PCB

新的表面安装LSI耐焊接热试验加湿技术

Novel Moisture Soaking Techniques Of Soldering Heat Test for Surface Mount LSIs

球栅阵列&更适合多端子LSI的表面安装式封装

Ball Grid Array : A Better Method of Surface - Mounted Package for Multi-Lead LSI

本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。

Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper .

LPS公司于1995年由一家全球知名跨国企业与国内一家电子企业合资兴建，生产表面安装半导体元器件。

LPS is a joint-venture by a famous multinational company and a home state-own-enterprise founding in 1995 , who produces surface mounting semiconductor device .

以BGA芯片为例，成功地将激光线结构光传感器用于表面安装技术中管脚共面性在线测量。

This article displays a successful application of the line-structured laser sensor in SMT-based BGA leads three-dimentional measurement .

DBC法不能满足表面安装技术所需小、薄、轻的要求。

It c-ould not meet the requirements of small , thin and light performance by DBC method .

本文主要对表面安装型塑封体（如SOP、PLCC、PQFP、PBGA等）在回流焊时吸湿开裂机理以及相应对策等进行讨论分析。

This paper is mostly studying and analyzing moisture-induced cracking of surface mount packages ( SOP , PLCC , PQFP , PBGA etc. ) under specified reflow soldering conditions , and put forward some corresponding countermeasures .

表面安装技术和手工焊接

Discussion on Suface Mounting Technology ( SMT ) and Poke Weld

用于表面安装的集成电路封装系列。

A family of integrated circuit packages for surface mounted assembly .

高密度表面安装电路板的测试技术探讨

The test technique discussion of higher density surface mount PCB

便携式表面安装热流计的动态特性分析

An Analysis on Dynamic Characteristics of the Portable Surface Heat Flow Meter

表面安装技术在雷达小型化中的应用

Application of Surface Mount Technology in Approaches to Radar Miniaturization

表面安装技术及其在光电子器件中的应用

Surface Mounting Technology and Its Applications in Optoelectronic Devices

表面安装：方便定位精度加工接受标准工业紧固件。

Mounting Surface : Convenient location precision machined to accept standard industrial fasteners .

对表面安装封装体的粘弹性翘曲问题的分析

Research of Viscoelastic Warpage Analysis of Surface Mount Package

表面安装元器件包装载带成型原理

Forming Principles of Carrier Tape Used for SMD Package

使用表面安装技术的柔性电路进展

Development of Flex Circuits with Surface Mount Technology

表面安装技术在物探仪器上的应用正确选型和安装水质在线监测仪器

SMT Application in Seismic Equipments Correctly Select and Install Water Quality Monitoring Instrument On-line

表面安装过程中的缺陷及解决方法

Dealing With Defects Occured in Surface Mount Process

表面安装电路板组件可靠性的计算机仿真分析

Computer Simulation Analysis of SM Board Assembly Reliability

在标准表面安装工艺中集成倒装芯片

Integrated Flip-Chip in Standard Surface Mount Technology

表面安装印制板

Mounting of PCB by Surface Mounting Technology

表面安装器件及其国内外发展状况

Surface Mounting Device and Its Development

多工位共用安装的夹具定位布局优化设计一种新颖实用的分立式表面安装元器件老化夹具

Optimal Method of Select Locating Points for Multi-operation Fixture A Novel Jig for Aging Discrete SMDs

介绍表面安装元器件包装塑料载带回转成型和线性成型原理。

Introduce rotatory forming and linear forming principles of the plastic carrier tape used for SMD package .

表面安装器件及表面安装技术

Surface Mounted Devices and SMT

表面安装元件布局机

Surface mount component placement machine