硅片清洗

HF／O3在300mm硅片清洗中的应用

HF / O_3 Application in 300 mm Wafer Cleaning

关于抛光硅片清洗和IPA干燥技术的研究

A Study About Polished Wafer Cleaning and IPA Dryer Technique

硅片清洗研究进展圆片级封装技术展望

Silicon wafer cleaning The Development of Wafer - Level Packaging

硅片清洗原理与方法综述

Theory and Method of Silicon Wafer Cleaning

硅片清洗方法探讨

Study of Methods for Cleaning Silicon Wafers

半导体硅片清洗工艺发展方向

Developing Trend of Wafer Clean Process

硅片清洗及最新发展

Silicon Wafer Cleaning and New Development

本文介绍了几种硅片清洗的方法，同时对各种不同清洗方法的工作原理、清洗效果、适用范围等特点进行了分析。

Several methods for cleaning silicon wafers are introduced with their working principles , cleaning effect and application scope analyzed .

TAW-3硅片自动清洗装置的设计

Design of TAW-3 Automatic Washing Machine for Silicon Wafer

氢氟酸在硅片化学清洗中的副作用

Side Effects of Hydrofluoric Acid on the Chemical Cleaning Silicon chip

超净硅片表面化学清洗工艺的优化研究

Optimization of Si Wafer Chemical Cleaning Process

对目前硅片湿式化学清洗方法中常用的化学清洗溶液的清洗机理、清洗特点、清洗局限以及清洗对硅片表面微观状态的影响进行了详细论述。

The paper introduced the cleaning principle , cleaning characters , cleaning limitation and the effect to the surface micro-condition of some traditional cleaning solutions .

本设备为封闭式清洗机，具有喷淋、浸泡功能，用于半导体工业硅片及零部件的清洗。

This close-type wet process equipment is used to clean substrates and parts by chemical spraying and soaking .