硅晶圆

绿色的“非金属添加工具（metalfreetool）”标志意味着硅晶圆必须得经过这台机器的处理以后，才能去添加铜质电路。

The green " metal free tool " sign indicates that this machine is used in a part of the process prior to the addition of copper circuits .

在IC芯片制造过程中，将排布在硅晶圆上的集成电路切割分离是其中一个重要的工序，目前用于切割分离集成电路的刀具主要是金刚石超薄切割片。

In process of fabricating integrated circuit , a key technique is to separate the integrated circuits on the silicon wafers .

硅晶圆大圆片上切割而成的一个小片半导体材料。

Die : A single piece of semiconductor material that has been cut from a slice by scribing and breaking .

晶圆级封装、三维芯片堆叠和绝缘体上硅技术是推动晶圆键合技术发展的三大动力。

WLP ( Wafer Level Package ), 3-D Chip Stacking and SOI ( Silicon-on-insulator ) are the three impetuses for the development of wafer bonding technology .