微电子

近几年，随着微电子技术、无线通信和信息网络的快速发展，无线传感器网络（wirelessSensorNetworks，WSN）应运而生。

Wireless sensor networks have emerged with the rapid development of the micro-electronics technology , wireless communications and information networks in recent years .

不仅如此，随着CMOS特征尺寸的不断缩小，微电子技术的发展也将面临无法克服的瓶颈。

Meanwhile , as the CMOS size is keeping decreasing , the development of micro-electronics technology also faces the unsolvable bottleneck .

无线传感器网络（WSN：WirelessSensorNetwork）是一门集中了嵌入式技术、微电子技术、传感器技术、分布式信息处理技术和通信网络等技术的交叉学科，也是当前国际的热点研究领域之一。

Wireless sensor network is the interdisciplinary of the embedded technology , microelectronics , sensor technology , distributed information processing technology and communication networks .

丝网印刷与厚膜IC技术是微电子技术的核心技术之一。

Screen printing and thick film IC technology are the core of microelectronics .

微电子制造中Ti的湿法蚀刻

Wet Etching of Ti in the Microelectronic Manufacture

利用微电子测试图形研究CMOSIC的锁定效应

Study on the Latch-up Effect of CMOS IC by Using Microelectronic Test Patterns

对研究采用CA方法模拟微电子加工工艺和进行微电子器件分析具有参考意义。

The prospect of CA methods for microelectronic process simulation and electron device analysis is discussed .

然目前的IC封装设备主要还是由国外垄断，因此尽快实现微电子设备的自主开发就成了我国的迫切任务。

So it is a very urgent task to develop the packaging machine quickly by our own .

基于Ansysworkbench的微电子封装自动化湿气分析系统开发

Development of Moisture Analysis Automation System for Micro-Electronic Package Based on ANSYS Workbench

基于ANSYS平台，利用VC语言开发了一个专门针对微电子金属封装温度场的仿真系统。

A simulation system for microelectronics metal encapsulation has been developed based on ANSYS platform using VC language .

微电子机械系统（MEMS）的迅速发展，使过程机械装置的微型化和轻量化成为可能。

The development of MEMS makes it possible that the process machinery being miniature and light weight .

Si被广泛的应用于各种集成电路和半导体器件中，是微电子产业的基础材料。

Silicon is applied to all kinds of integrated circuit and semiconductor device , and it is an foundational material of microelectronic industry .

随着数字电路和微电子技术的发展，DDS技术日益显露出它的优越性。

DDS has shown its advantages increasingly along with the development of digital circuits and microelectronics technique .

聚焦离子束（FIB）技术及其在微电子领域中的应用

Focusedion beam technology and its applications in the field of microelectronics

随着微电子技术的发展，SoC的集成度越来越高，设计复杂性日益增大。

With the development of microelectronics technology , the integration of SoC increases rapidly , and design complexity augments increasingly .

磷化铟（InP）已成为光电器件和微电子器件不可或缺的重要半导体材料。

Indium Phosphide ( InP ) has been indispensable to both optical and electronic devices .

随着微电子技术的发展，将DSP芯片技术运用于地球物理勘探仪器之中，提高实时数据处理效率成为重要的发展方向。

With the development of microelectronics , using DSP chip in geophysical exploration instruments to improve the efficiency of real-time data processing is a significant research subject .

热释电摄像管本底补偿技术在烧结氧化中Se气氛对真空微电子平板摄像管CdSe靶面性能的影响

Pedestal Compensation Technique of Pyroelectric Vidicon Effect of Se Source Temperature on Performances of CdSe Target in VME-FPC

氧化铝（Al2O3）薄膜具有许多优良的物理化学性能，在机械、光学及微电子等高科技领域有着广泛应用，一直受人们高度关注。

Aluminum oxide ( Al_2O_3 ) thin films are widely used in mechanical , optical and microelectronic applications because of their excellent physical and chemical properties .

近几年随着微电子技术和数字信号处理技术的飞速发展，DSP的性能价格比不断提高，受到业界越来越广泛的关注。

With Lhc development of the microelectronics technology and digital signal process technology , the performance of DSP has been highly enhanced and the price has been reduced .

随着集成电路、微电子系统、数字信号处理和嵌入式Internet的发展，一种新的信息获取和处理模式&无线传感器网络得到了广泛的关注。

With the development of integrated circuitry , micro electromechanical system , digital signal processing and the embedded Internet , a new information gathering and processing model & wireless sensor network has received widespread attention .

整个实验表明，用微电子测试图形监控CCD工艺、分析器件失效，是可行可靠的。

The whole experiment demonstrates that monitoring the quality of CCD process and analysing failure of the device by microelectronic test patterns is practical and reliable .

简要叙述了微电子机械系统（mems）研究中的多单元综合体&微型系统，包括它的种类、结构、工作原理及相关的特性。

This paper describes the sorts , structures , operational principles and characteristics of the microsystems , a new popular research field in mems .

微电子机械系统（MicroElectroMechanicalSystems，简称MEMS）是由微传感器、微执行器、信号处理和控制电路、通讯接口和电源等部件组成的一体化的微型器件系统。

Micro Electro Mechanical systems ( MEMS ) are integrative micro-device systems that consist of micro-sensor , micro-actuator , controlling and signal processing circuit , communication interface and electrical source .

研究表明：MOS电路等微电子器件，在ESD作用下确实存在潜在性失效问题。

It shows that the problem of latent failure exists for MOS circuit after the ESD stresses imposed on it .

先进的MCM微电子组装技术

Advanced MCM microelectronic mounting technology

随着微电子技术的进步，用实时计算来代替ROM查找表已成为可能。

With the development of the micro-electronics techniques , it is possible to substitute ROM by a real-time computer .

微电池在未来的便携式电子设备、国防装备及微电子机械系统（MEMS）等方面有着广泛的应用前景，受到人们的重视。

Recently , micro-batteries are attracting excessive attentions for its ' potential applications in many aspects such as portable electronic productions , national defense and MEMS .

这些微器件与信号调节和处理电路集成后，组成了可执行分布式实时控制的微电子机械系统（MEMS）。

These micro transducers can be integrated with signal conditioning and processing circuitry to form micro-electro-mechanical systems ( MEMS ) that can perform real-time distributed control .

SiGe技术是微电子领域的前沿技术，在硅基集成电路方面有重要应用。

SiGe is one of the promising materials to the microelectronics and has important application on silicon integrated circuit .