小外形封装
- 网络SMALL OUTLINE PACKAGE;SOP
小外形封装-
GB/T15878-1995小外形封装引线框架规范
Specification of lead frames for small outline package
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把有限元和各种计算方法进行不同地结合，是研究预测薄型小外形封装（TSOP）翘曲问题的最佳方法。
In this article , different combinations of finite element and calculating methods were used to investigate the best method for predicting the thin small outline packages ( TSOP ) warpage .
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可控坍塌芯片连接（C4）技术可以实现高速、高密度、小外形的封装，因此日渐得到关注和发展。
Controlled Collapse Chip Connection ( C4 ) technology is gaining increasing popularity because it achieves high electrical interconnects speed , high density and low profile packages .