芯片封装技术

近年来，随着IC制造业的快速发展，对芯片封装技术有了更高的要求。

In recent years , as the rapid growth of IC manufacturing , the IC packaging technology suffers huge challenge .

CMOS工艺的不断发展和芯片封装技术的不断进步，使得大尺寸的片外元器件成为制约整个系统体积的瓶颈。

The continued scaling down of the CMOS process and rapid improvement of integrated-circuits package techniques have made the large off-chip passive components become the bottleneck to constraint the overall system volume .

CSP是内存芯片封装技术的新概念，它的出现促进内存芯片的发展和革新，并将成为未来高性能内存的最佳选择。

CSP has developed and innovated the memory chip since it was appeared . It is believed that CSP will be the best choice of the memory with high performance .

QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。

The QFN package ( Quad Flat No-lead Package ), a new and developing technology for chip package , is a small footprint , low profile , surface mount , plastic encapsulated package with leads on the bottom .

随后对收发一体模块的结构进行了设计，探讨了SLD芯片封装技术，通过热阻理论对其进行热力学表现进行分析，使用有限元法对理论分析进行了数值求解。

Then the structure of the integrative transceiver module has been designed . The SLD chip packaging technology was discussed . Its thermodynamic performance was analyzed by thermal resistance theory . The numerical solution for theoretical analysis was given by the finite element method ( FEM ) .

本文简要介绍了几种内存芯片封装技术的特点。

Characteristics of several advanced chip package technology are introduced in the paper .

多芯片封装技术及其应用

Multi - Chip Packaging Technologies and its Applications

压力传感器的芯片封装技术

The Chip Mounting Techniques for Pressure Sensors

本文主介绍了国际上内存芯片封装技术的现状以及未来的发展等。

The current situation and future of memory chip package technology are introduced in the paper .

芯片封装技术介绍

Introduction of the chip package technology

这一技术可以广泛应用于微电子行业中的芯片封装技术，它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。

This technology can be widely used for chip encapsulation in the field of micro-electronics . The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip .

芯片堆叠封装技术是实现NAND存储器的高容量和薄型化的理想解决方案，它能够满足市场对存储器小型化和便携式的要求。

Stacked Die assembly technology is an ideal solution to a NAND product with higher capacity and lower profile , which meets the requirements of miniaturization and portable of product .

COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。

COF is a high performance , multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components .

超薄型圆片级芯片尺寸封装技术

Ultrathin Wafer Level Chip Size Package Technology

芯片规模封装技术一直倍受高性能、小形状因素解决方案在各类应用中的关注。

Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions .

同时，列举了当前主要的工艺特征与技术要点，从而说明多芯片封装的技术及其发展前景。

The main and important technological points of MCP are also listed and so that the technological superiority and the developmental prospects of these new package technologies are shown .

在表面形貌测量、精密加工、微机电控制系统、生物医学工程以及芯片光刻与封装技术中，高精度的XY二维位移运动工作台具有重要的意义。

The high precision two-dimensional stage is very significant in the field of surface topography measurement , precision machining , Micro-Electro-Mechanical system , Biomedical Engineering and IC / MIMS manufacturing .

适用于超大集成电路的芯片倒扣封装技术

Flip-chip Interconnection and Assembly Technology for Ultra Large Scale Integrated Circuits

倒装芯片将成为封装技术的最新手段

Flip Chip will be a New Method of Packaging Technology

芯片尺寸封装工艺技术

A Summary of the Process Technology for Chip Scale Package

BGA/CSP和倒装焊芯片面积阵列封装技术

Area Array Package BGA / CSP flip chip

同时，从中可以看出芯片技术与封装技术相互促进，协调发展密不可分的关系。

At the same time , make out the close relation between IC chip and microelectronic package technology .

结合参加“先进封装技术研讨会”的情况和分发给与会代表的资料，介绍了芯片级的封装技术的现状及发展趋势。

According to the " advanced packaging technology conference " and technology information , the actuality and development of packaging technology were introduced .

综合介绍了目前半导体大功率激光器普遍采用的材料结构、芯片结构、封装技术、散热致冷技术以及发展现状；

The paper present the development of high power laser array , the material structure , the chip structure and the techniques of package , heat-transportation and cooling .

对压力传感器芯片的各种封装技术作了比较和讨论，指出它们的优缺点和适用场合。还对各种封接键合材料的特性作了概括。

The various chip mounting techniques for pressure sensors are compared and discussed in this paper , with showing their advantage and disadvantage as well as the applying conditions .

介绍了MEMS封装技术，包括单芯片和多芯片封装技术。

This paper describes the developments in MEMS packaging technologies , including single chip and multi chip packaging solutions .

简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。

This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption , low weight and compact systems .

在微电子封装中，焊锡接点互连不仅用于芯片级的倒装芯片（FC）封装技术，而且广泛用于电路板级封装的球栅阵列（BGA）封装技术。

In microelectronic packaging , solder joints are used not only for chip-level flipchip ( FC ) packaging technology , but also widely used in board-level , ball grid array ( BGA ) packaging technology .

微电子技术的不断发展，要求集成电路芯片具有更多的I/O数、更小尺寸和更高的性能，面阵列芯片封装技术（BGA、flipchip等）很好地满足了这些要求。

With the development of micro-electronic technology , the technology on area array packaging ( such as BGA , Flip Chip ), which provides more I / Os , smaller size and better performances of the chip than many standard packages , is developed rapidly .