芯片集成度

随着IC设计自动化程度的提高和芯片集成度的上升，验证工作的复杂度和工作量呈指数趋势上升。

The workload of verification increases exponentially as the continuous improvement of IC design automation and chip scale .

本文首先简介了运动目标跟踪系统使用的高速图像处理平台。随着DSP和CPLD/FPGA芯片集成度和运算速度的提高，出现了大量基于DSP+CPLD‖FPGA的高速图像处理平台。

High-speed image processing platform , based on DSP and CPLD / FPGA , is firstly introduced in this thesis .

同时，DSP技术也日益发展，芯片集成度、运算速度、数据吞吐率等性能的提高，使得DSP广泛地应用在视频监控以及相关领域。

Meanwhile , DSP technology is also growing , the improvement of chip integration , processing speed , data throughput and other performances make the DSP be used in video surveillance and related fields widely .

同时，随着DSP芯片集成度、运算速度、数据吞吐率等性能的不断提高，它已被广泛地应用于许多视频处理与传输领域。

At the same time , DSP chip is used widely in video processing and transmission field , because it 's integration density , computing speed and digital taking in and sending out rate is improved continuously .

当前，随着CMOS工艺尺寸的逐步缩小和芯片集成度的大幅提高，有线互连在延时、功耗等方面遭遇巨大挑战，已接近互连金属材质的极限。

Nowadays , as CMOS technology scales gradually and chip integration grows rapidly , wired interconnection encounters great challenges in terms of delay and power consumption , which almost reaches the intrinsic limitations of metal materials .

该方案以AHB总线作为片上互连总线，便于各IP核的集成。应用需求的增长和系统芯片集成度的不断提高，对系统芯片片上互连结构提出了更高的要求。

In order to simplify the integration of IPs , the design scheme makes use of AHB bus as the interlinkage on-chip bus . Higher performance of the on-chip interconnection is needed because of the improvement of the system-on-chip integration and application requirements .

应用需求的增长和系统芯片集成度的不断提高，对系统芯片片上互连结构提出了更高的要求。

Higher performance of the on-chip interconnection is needed because of the improvement of the system-on-chip integration and application requirements .

随着芯片集成度的增长，散热问题成为影响设计可靠性和封装成本的主要因素。

With the development of chip integration , cooling problem has become the main factor that affecting the design reliability andpackage cost .

随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。

With the increase of chip integration level and packaging density , the heat density generated in computer keeps increasing exponentially in recent years .

集成电路的发展是芯片集成度不断提高的过程，更小线宽尺寸的芯片代表了更高的性能、更低的成本。

The development of integrated circuits is the progress of integration level . The smaller critical dimension means the better chip performance and lower cost .

随着半导体工艺的进步，芯片集成度和运算速度的提高，互连寄生效应的影响也日益明显。

The influence of parasitic interconnect capacitance is much in evidence with the progress of the semiconductor techniques and the increase of chip density and calculated speed .

推动半导体价格下降的因素是芯片集成度提高，以及产量快速提高所带来的规模经济。

To promote the semiconductor prices have fallen factor is the increasing chip integration , and the rapid increase in production brought about by economies of scale .

随着芯片集成度的提高，器件加固技术的难度越来越大，加固技术出现激烈竞争。

With the density of chip integration getting higher , hardening technologies for devices became more and more difficult . A competition is existing between different hardening technologies .

作为有史以来发展最为迅速的工业之一，半导体工业的进步使大规模集成电路的特征尺寸不断缩小、芯片集成度不断提高。

As one of the fastest developing industries , the improvement of semiconductor industry makes it possible to produce VLSI devices with continuous decreasing feature sizes and increasing integration .

随着芯片集成度和印刷电路板复杂度的不断提高，边界扫描测试技术在芯片故障检测中的应用越来越广泛。

With the continual improvement of the chip 's integration level and complexity of print circuit board , the application of boundary scan test technology becomes wider and wider in testing ICs .

随着技术的不断进步，材料的物理性能限制了时钟频率和芯片集成度的进一步提高，使得通过这两种方式来提高单核处理器性能已非常困难。

With the development of technology , the physical capability of materials restricts the enhancing of clock frequency and integration density , which makes it hard to advance the processing capacity of single-processor .

新世纪以来，随着编解码技术本身的进步和芯片集成度、计算速度实现条件的发展，数字音视频编解码技术标准面临更新换代的历史性机遇。

Since this century , with the great development of the codec technology , the rapid development in IC and computing technology , the digital audio and video coding standard is facing with a historic opportunity .

随着微电子学高速发展，芯片集成度越来越高，速度越来越快，使基于硬件开发的图像识别成为可能。

With the rapid development of micro-electronics , integration density of chip integration increases increasingly , and processing rate becomes faster and faster , so that it is possible to realize image recognize technology based on hardware .

芯片集成度的提高和大面积化，封装多针脚、引线、型化等会引起器件可靠性的下降。

The rapid increase in the integrated degree and dimension of chips , the more I / O pins number , fine line pitch and miniaturization in package would result in the degradation of reliability of electronic devices .

因此在目前的消费类电子中，其受到很多厂商的青睐，有着很大的需求量。然而随着芯片集成度的提高和功能复杂性的提升，也为芯片测试带来了新的挑战。

Therefore , it is favored by many manufacturers and has a huge demand in the current consumer electronics market . However , with the improvement of chip integration and functional complexity which brings about new challenges of testing .

近年来，随着数字集成电路工艺的迅速发展，芯片集成度的进一步提高，电路规模变得越来越大，复杂度也越来越高，其功能正确性也越来越受到人们的重视。

In recent years , with the rapid development of digital integrated circuit technology , the chip integration has been further improved , and the circuit scale has become increasingly large , and the complex degree is very higher .

半导体工艺的持续发展和芯片集成度的显著提高，导致芯片发热量的增大与可靠性的下降，限制了性能的进一步提升，功耗已经成为微处理器设计领域的一个关键问题。

With the sustainable development of semiconductor technology and the significant increment of chip integration , heat of chips keeps increasing while reliability keeps declining . It limits further improvements of performance , making power a key issue in the microprocessor design area .

片上系统技术通过知识产权核（IP：Intellectualproperty）的复用提高生产率，缩短产品上市时间，同时也显著提高了芯片的集成度。

Relative to traditional ASIC ( Application Specific Integrated Circuit ), SoC improves the complexity remarkably , shortens the time to market and reduces the design cycle based on IP ( Intellectual Property ) core reusing .

随着芯片的集成度越来越高，在以SoC为发展趋势的集成电路设计中，如何实现上电复位电路的片内集成将成为保证系统芯片正常复位的关键问题。

With the fast development of IC integration , how to implement on-chip power-on reset circuit becomes one key issue to guarantee normal reset of SoC .

内置的过热保护电路、过压保护电路、低压锁定电路，不仅提高了芯片的集成度，也使得芯片在非正常工作状态下能够自动的关断，保护芯片的同时也防止了对LED的破坏。

The over-thermal protection circuit , the output over-voltage protection circuit and the low-voltage shutdown circuit built-in not only make integrity increase , but also make chip automatically shutdown in the non-normal operation and protecting LED .

随着CMOS工艺技术的不断发展，芯片的集成度逐渐增大，芯片面积也在随着变小，许多的功能模块都被集成在一个芯片上，而且工作频率也达到了吉赫兹。

With the continuous development of CMOS process technology , chip integration gradually increasing , chip area also become smaller with it , many of the functional modules are integrated on a chip , and the operating frequency to Gigahertz .

另一方面，随着VLSI设计技术的发展，芯片的集成度越来越高，尤其对于视频编解码芯片来说，系统的设计规模和复杂度大大增加。

On the other hand , along with the development of VLSI design technology , more and more transistors can be integrated into one chip , and the design scale and complexity of the chip greatly increased .

SoC芯片的集成度越来越高，运行频率越来越快，面市时间越来越短，为了实现这样的系统，设计者越来越依赖于IP核的重用。

Because SoC chips ' density and frequency are getting higher and higher , and their time to get into the market is getting shorter and shorter , the designers incline to depend more and more on IP core in the designing of SoC chips .

由于集成电路技术的发展，芯片的集成度越来越高，如何实现FPU的功能、提高FPU的性能已成为一个重要的研究课题。

Chip integration density becomes higher and higher because of the progress of IC technology . People pay more attention on how to realize FPU function and improve its performance than before .

随着深亚微米工艺的迅速发展，芯片的集成度和操作频率越来越高，在单个芯片上能集成越来越多的异构处理资源，如多个通用RISC处理器，各种专用协处理器和硬件加速器等。

With the development of deep sub-micron technology , chip 's frequency and integration goes higher , more and more process resource can integrate into a single chip , such as a few of general-purpose RISC processor , various specific co-processor and hardware accelerator , etc.