芯片尺寸封装

芯片尺寸封装（CSP）技术

The Chip Size Package Technology

圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。

This wafer level chip size package ( WL-CSP ) process encases the die in a solid die-size glass shell .

MEMS圆片级芯片尺寸封装研究

Study on Wafer - level Chip Scale Package for MEMS

步入主流技术的芯片尺寸封装（CSP）技术

Chip-size-package Technology Moves into the Mainstream

先进的芯片尺寸封装（CSP）技术及其发展前景

CSP technology and its development foreground

芯片尺寸封装（CSP）技术是近年来发展最为迅速的微电子封装技术之一。文章介绍了目前出现的四类CSP结构形式，分析了每种结构的工艺技术特点及其制作方法

Chip scale package ( CSP ) is a new microelectronic packaging technology rapidly developed in recent years Four types of CSP devices are described and fabrication technologies for each of them are analyzed in the paper

本文介绍了最新的超薄叠层芯片尺寸封装（UT-SCSP），它是CSP封装与叠层封装相结合的产物。

In this paper , the latest type UT-SCSP is introduced . It is the result of combining the CSP with the stacked package .

概述了芯片尺寸封装（CSP）的基本结构和分类，通过与传统封装形式进行对比，指出了CSP技术具有的突出优点，最后举例说明了它的最新应用，并展望了其发展前景。

Basic structure and classification of chip scale package are summarized in this paper , and its excellent merits are also indicated by comparison with traditional packaging styles . At last , new applications and development foreground of CSP are introduced through some examples .

晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。

Wafer chip scale packaging ( WCSP ) eliminates conventional packaging steps such as die bonding , wire bonding , and die level flip chip attach processes .

综述了圆片级芯片尺寸封装（WL-CSP）的新技术及其应用概要，包括WL-CSP的关键工艺技术、封装与测试描述、观测方法和WL-CSP技术的可靠性及其相关分析等。

The wafer level packaging ( WL-CSP ) technologies and their application progresses , which including the key technologies of WL-CSP , the package test description , the observation method and the reliability the analyses of WL-CSP are summarized .

芯片尺寸封装工艺技术

A Summary of the Process Technology for Chip Scale Package

超薄型圆片级芯片尺寸封装技术

Ultrathin Wafer Level Chip Size Package Technology