片式元器件

片式元器件带式包装机分布控制系统的设计

The Design of the Distributed Control System for Surface Mount Components

新型片式元器件在电子信息技术领域的应用

Application of new chip components in the electronic information industry

世界片式元器件的包装及管理技术

The Package and Management of Chip Components and Devices

介绍了片式元器件的先进包装技术以及管理上所采用的技术标准。

Introduced the package technology and technical standards for management of chip components and devices .

该材料可用于制作介质滤波器及分米波通信设备用的小型、轻量的片式元器件。

This kind of material is used to make dielectric filters and miniature , light and chip components for communication equipments in decimeter-wave region .

片式元器件体积小、重量轻、成本低、可靠性高，在电子设备上得到广泛的应用。

Since slice elements have the advantages of small , light , low cost and high reliability , they have found wide application in electronic equipment .

简要介绍了片式元器件载带分切设备的市场需求，经济技术性能指标以及所要解决的关键技术，为产品开发的可行性研究提供一定的经济和技术参考。

This article introduces the market demand , economic technique performance and the key technology of the chip-element strip cutting machine . It can provide determinate economic and technology reference for the feasibility of the machine exploitation .

PLC在片式电子元器件高速包装机的应用

Application of PLC in High-speed packing Machine with Sheet Electric Elements

研究了对片式电子元器件以纯Sn镀层取代可焊性优异但环保性差的Sn–Pb镀层在生产过程中遇到的问题及解决途径。

The problems occurred in the replacement of Sn – Pb coating , which has excellent weldable but bad environmental protection performance , by the pure tin coating and their solutions were studied .

片式电子元器件中无铅可焊镀层的研究感应熔涂技术与电刷镀结合修复轴类零件

Study on Lead-free Weldable Coating of Chip Electronic Components Recovery of Shafts and Axles by Combing Induction Remelting with Coating and Brush Plating

电子陶瓷薄膜是片式电子元器件制造和大规模集成电路封装的关键薄膜材料，它是在高精密流延机上利用电子陶瓷浆料流延获得的。

Electronic ceramic thin tape is a kind of key materials for electronic chip components fabrication and IC packaging . They can be cast by the use of electronic ceramic slurry in a high precision tape casting machine .

片式多层陶瓷电容器是新型片式元器件门类的主要品种之一。

Multilayer ceramic capacitors ( MLCC ) is one of the main products of the new surface mounted components ( SMC ) .