片式电容

  • 网络chip capacitor
片式电容片式电容
  1. 从数字看发展片式电容器面临的机遇与挑战

    Development of Chip Capacitor in China : Opportunity and Challenge

  2. 介绍了片式电容器自动测试分选机的系统组成、测试和分选原理及软件功能及设计要点。

    Introduce the system constitution , test , selecting principle and software function and design key point of automatic test and selecting machine of chip capacitor .

  3. 新型片式电容器用高比容铌粉的特性

    Characteristics of High Capacitance Niobium Powders Used for New Chip Capacitors

  4. 片式电容层压机的结构原理及其工艺

    Structure Principle and Technology of the Chip Capacitor Press Machine

  5. 片式电容器浪涌及老化测试系统的设计与实现

    A Novel Surging and Burn-in Test System for Slice Capacitor

  6. 通过选取电极材料、气氛控制和温度控制等,对以Ni为内外电极的多层片式瓷介电容器的制作工艺已经成功在实验室得到验证。

    Through to select the electrode material , ambience control and temperature control etc , to succeeded to get the verification in the laboratory to manufactory technology of BME-MLCC with Ni inner and termination electrode .

  7. 本文评述了我国多层片式陶瓷电容器、PDP平板显示器、硅太阳能电池、电子封装等的发展现状以及对电子浆料的要求,同时还评述了贱金属浆料的发展趋势。

    The development of the chip ceramic capacitor , PDP ( plasma displays ), silicon solar cell and electronic package was reviewed in the present paper , and the requirements to electronic pastes and the growing trend of base metals electronic pastes were introduced .

  8. 国内外片式钽电容器的开发与发展

    Production and Development of Chip Ta Capacitors at Home and Abroad

  9. 2200℃片式钽电容器真空烧结炉的研制

    Development of 2200 ℃ vaccum sintering furnace for chip Ta capacitor

  10. 三工位片式钽电容器真空预烧炉的研制

    Development on the three-location vacuum pre-sintering furnace for Ta capacitor

  11. 多层片式瓷介电容器贱金属电极的制造方法

    Manufacturing Technology of Multi-layered Ceramic Capacitor with Base Metal Electrode

  12. 新型片式铌电容器老化方法的研究

    Research on Aging Method for New-Type Niobium Chip Capacitor

  13. 面向医疗市场的新型微片式钽电容

    Prescription for the Medical Market : Tantalum Microchip Capacitors

  14. 片式钽电容成形模设计

    Design of the Die for the Sliced Tantalum Capacitors

  15. 多层片式瓷介电容器标准中几个问题的讨论

    Some problems with the standards regarding MLCC 's

  16. 片式有机电容器的研究进展

    Progress in Research of Chip Film Capacitors

  17. 片式陶瓷电容器技术的新进展

    New Progress in Chip Ceramic Capacitors Technique

  18. 100mF·V/g钽粉在片式钽电容器上的应用研究

    Research on Application of 100 mF · V / g Tantalum Powder in Tantalum Chip Capacitor

  19. 近期目标是把公司发展成为国内多层片式陶瓷电容器前三位的具有较高科技水平专业生产企业。

    The short-term goal is to develop YJ into one of domestic top three professional manufacturers with relatively high Technology in MLCC industry .

  20. 介绍了三工位片式钽电容器真空预烧炉的基本结构、工作原理及钽电容器阳极块真空预烧的工艺过程,并对该设备在片式钽电容器制造行业的意义进行了阐述。

    In this paper , the basic constructure , operation principle and technical process of the three-location vacuum pre-sintering furnace for Tantalum capacitor are described . And the application of this equipment in Tantalum capacitor manufacture trade is introduced .

  21. 这些高比容钽粉基本上能满足于高CV片式固体钽电容器的制作要求。

    These powders are substantially able to meet the requirements of manufacturing high CV chip tantalum solid capacitors .

  22. 随着片式多层陶瓷电容器(MLCC)工作频率的提高,要求其在高频状态下必须保持较低的等效串联电阻(Res)。

    As MLCC work frequency is improved , it is requested to keep low ESR at the high frequency condition .

  23. CCH型片式高压陶瓷电容器

    Type CCH High Voltage Ceramic Capacitors

  24. 本论文旨在开发适用于片式多层陶瓷电容器(MLCC)电极材料的、粒径均一、分散性好、致密的均分散铜粉制备技术。

    This dissertation aims at developing a new synthesis process of copper powder with uniform partical size and good dispersibility suitable for MLCC ( multilayer ceramic capacitors ) electrode .

  25. 贱金属片式多层陶瓷电容器(BME-MLCC)端电极用铜浆由有机载体、玻璃料、铜粉等组成。

    The copper paste for termination electrode of BME-MLCC is composed of organic vehicle , glass frit , copper powder and others .

  26. GB/T3615-1983电解电容器用铝箔片式铝电解电容器的设计与工艺探讨

    Aluminium foil for electrolytic capacitor Design and technology of chip electrolytic capacitors

  27. 片式独石电容器耐压绝缘测试分选机的研制

    Design and Development of Test Selector of Chip Capacitor Voltage-resistance and Insulation

  28. 高频低阻抗片式固体电解电容器的进展

    Advance of chip solid electrolytic capacitors of high frequency and low impedance

  29. 片式化高压电容器的内电极结构及优化

    The inner electrode structure and its optimization for high voltage chip capacitors

  30. 适合无铅回流焊的片式铝电解电容器研制

    Study on SMD Aluminum Electrolytic Capacitors Resisting Lead-free Reflow Solder