多芯片组件

本文介绍了一种新的封装技术&微波多芯片组件（MCM）技术。

In this paper a novel packaging technology , Microwave MCM , was introduced .

多芯片组件（MCM）技术的发展及应用

Development and Application for MCM Packaging Technologies

基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究

Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model

层次化的光电多芯片组件CAD系统结构设计

Hierarchical CAD System Design for Optoelectronic MCM

应用结构导热与CFD耦合的多芯片组件热设计

MCMs thermal design based on thermal-liquid structure and CFD coupling method

布线是多芯片组件（MCM）CAD中的一个关键步骤。

Routing is a key procedure in the computer-aided-design of multi-chip modules ( MCM 's ) .

3-D多芯片组件（MCM）是未来微电子封装的发展趋势。

3-D Multichip Module ( MCM ) is the developing trend of microelectronic packaging in the future .

低温共烧陶瓷（lowtemperatureco-firedceramic，LTCC）多层基板技术以其先天的优势从众多的多芯片组件技术中脱颖而出。

Low temperature co-fired ceramic ( LTCC ) multi-layers substrate technology stands out from other multi-chip modules based on its natural advantage .

高端论坛多芯片组件（MCM）的互连延时

Top Level Forum Interconnection Delay in High-speed Multi Chip Modules

多芯片组件（MCM）是实现电子系统小型化的重要手段之一。

MCM is an important method of miniaturizing electronic systems .

多芯片组件（MCM）中互连线系统的矩量法分析

Analysis of Interconnects in Multichip Module by Moment of Method

热控制在多芯片组件（MCM）设计中有着极为重要的作用。

Thermal control plays a key role in a successful design of MCM .

多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测

Finite Element Simulation of Reliability and Life Prediction on Solder Joint of MCM

基于微机械系统的多芯片组件封装和特性模拟（英文）应用结构导热与CFD耦合的多芯片组件热设计

Characteristics simulation of MEMS packaging using multichip modules technology MCMs thermal design based on thermal-liquid structure and CFD coupling method

实现微波多芯片组件（MCM）电气互连的微连接技术是MCM组装的关键技术。

Micro-interconnect is the critical technique for realizing the interconnect of microwave multi-chip module .

简要介绍了多芯片组件（MCM）技术的由来、分类、结构、性能及应用。

Origin , classification , structure , performances and applications of MCM are described .

多芯片组件MCM的失效率预计研究

Research on the Failure Rate Prediction for MCM

介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。

This article describes the application of microelectronic plating in manufacture of semiconductor , IC packaging , micro-bumps , multichip modules and microelectronics mechanical systems .

LTCC微波多芯片组件中键合互连的微波特性

Microwave Characteristics of Bonding Interconnects in LTCC Microwave MCM

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3D堆叠式封装等。

Moreover , some major processes package of MEMS , including wafer-level packaging , single-chip packaging , multi-chip packaging and stacked 3D packaging , etc were discussed .

电子陶瓷材料在多芯片组件（MCM）中的应用

Application of Electronic Ceramics in MCM

多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。

Multichip module technology ( MCM ) is the optimal way of providing circuit system miniaturization .

高速多芯片组件（MCM）广泛用于高复杂度的系统中，而其中的同步开关噪声（SimultaneousSwitchingNoise）是影响系统功能的重要因素。

High speed Multi-Chip Module ( MCM ) has been widely adopted in the complex system , where simultaneous switching noise is one of the key factors affecting the system function .

多芯片组件（MCM）是目前实现机载雷达接收前端小型化的最有效途径。

MCM ( Multi-Chip Module ) is presently the most effective method for realizing the miniaturization of airborne radar receiver front-end .

微电子封装一般可分为三级封装，即用封装外壳（金属、陶瓷、塑料等）封装成单芯片组件（SCM）和多芯片组件（MCM）的一级封装，常称芯片级封装；

Microelectronic packaging is generally devided into three levels packaging . SCM and MCM are the first level packaging , are called chip level packaging ;

本文提出了一种用于求解高速VLSI和多芯片组件（MCM）中有耗互连线瞬态响应的稳定递归算法。

A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules ( MCMs ) .

通过对多芯片组件（MCM）的结构、失效模式和机理的分析，提出了适合我国生产实际的MCM失效率预计模型。

The structure , failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented .

MCM（MultiChipModule多芯片组件）技术的出现是为了满足电子产品多功能、小尺寸、重量轻、高速度、高可靠、高性能等方面的要求。

The MCM ( Multi Chip Module ) technique emerged for meeting the requirements of multifunction , small size , light weight , high reliability , high speed and high performance of the electronic products .

本文概述了低温共烧陶瓷（LTCC）三维多芯片组件技术的特点，并分析LTCC3D-MCM的发展趋势。

This paper describes the features of LTCC three dimension Multichip module technology , and analyzes the development trend of LTCC 3D-MCM .

所以进行本课题的研究就非常有实际意义。本文采用多芯片组件（MCM）技术对毫米波双通道接收前端进行了理论分析和设计，，并且进行了制作和测试。

Using multichip module ( MCM ) technology , The theory and design for the two-channel millimeter wave front-end is present in this thesis .