多芯片封装

介绍了微机电（MEMS）封装技术，包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。

The technologies of MEMS packaging are introduced , including three promising technologies : wafer level packaging , single-chip packaging and multi-chip packaging , modular MEMS packaging and flip-chip bonding for MEMS packaging .

本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。

The utility model discloses a multi-chip packaging structure comprising at least a loader , at least a packaging module , an insulation layer and a pattern metal layer .

介绍了MEMS封装技术，包括单芯片和多芯片封装技术。

This paper describes the developments in MEMS packaging technologies , including single chip and multi chip packaging solutions .

COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。

COF is a high performance , multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components .

多芯片封装技术及其应用

Multi - Chip Packaging Technologies and its Applications

关于两种多芯片封装的百瓦级半导体激光器的瞬态热特性也作了必要的分析。

The thermal characteristics in transient-state of two structures of hundred-watt semiconductor laser packaged with multi-chip was necessarily analyzed .

本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。

In this thesis , the application of the failure analysis in MCP package technology will be addressed along with some general FA instrument and methods .

同时，列举了当前主要的工艺特征与技术要点，从而说明多芯片封装的技术及其发展前景。

The main and important technological points of MCP are also listed and so that the technological superiority and the developmental prospects of these new package technologies are shown .

图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。

The pattern metal layer is arranged on the insulation layer and filled into the diversion holes , thereby being an inner linking layer of the multi-chip packaging structure of the utility model .

该封装结构无论是应用于单芯片还是多芯片阵列封装，都可以满足LED的散热要求。

The packaging both for single-chip and multi-chips could meet the heat-release requirement for high-power LEDs .

基于微机械系统的多芯片组件封装和特性模拟（英文）应用结构导热与CFD耦合的多芯片组件热设计

Characteristics simulation of MEMS packaging using multichip modules technology MCMs thermal design based on thermal-liquid structure and CFD coupling method

一种硅埋置型微波多芯片组件封装的电性能基于多芯片组装技术的小型微波收发前端研制

Performance of a silicon-based embedded MMCM package Development of a Miniature T / R Front-end Using Microwave Multi-Chip Module Technology

垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。

Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM , further study on vertical via interconnect is very vital and instructive to reality .

随着硅片减薄技术的成功使用，多芯片叠层封装的厚度几乎与过去BGA封装具有相同的厚度（约1.2毫米）。

The successful thinning of wafer by back-grinding has made the thickness of the 3-D multi-chip stacked die package similar to that of BGA ( about 1.2 mm ) .

在3D-MCM（多芯片组件）封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。

In 3D-MCM ( multi chip module ) packaging designs , heat dissipation is one of the key issues that must be solved .

多芯片叠层封装中的芯片应力分析及结构优化

Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package

本文根据实际的多芯片组件的封装结构，建立了三维温度场分析模型，分析了金刚石作为导热层和基板对多芯片组件散热性能的改善；

Being based on actual multi-chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi-chips module is conducted using diamond substrate and thermal interfacial materials ;

简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。

This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption , low weight and compact systems .

结果表明，该封装产品可以在更低的封装高度下实现，并具有更低的芯片热应力水平及更小的封装体翘曲，这有助于提高多芯片叠层封装产品的可靠性。

Structure optimization of the package design in different approaches shows that thinner package body , lower chip stress level and smaller package warpage can be realized in this product . The study would be beneficial to improve the reliability of stacked MCP products .

大功率LED多芯片基板上直接封装的热设计

Thermal Design of High-Power LED Multi-Chip on Board Package

本文对金刚石材料在多芯片组件热性能改善和热应力研究，对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。

Results in the paper will supply references to thermal designs of multi-chip module packaging based on diamond material .