划片

IC划片、组装气动控制系统

The Pneumatic Control System for IC Scribing and Assembling

InSb的激光划片研究

Study on Laser Scribing of InSb Wafer

高亮度LED晶圆紫外激光划片技术研究

The Technology Study on UV Laser Dicing High Brightness LED Wafer

YAG调Q激光陶瓷基板划片机

Ceramic Substrate Nd : YAG Q-Switching Laser Cutter

分析了YAG调Q激光陶瓷基板划片的机理。

The mechanism of cutting ceramic substrate by using Nd : YAG Q-switching laser was analyzed .

研究了对InSb的激光划片过程，得出了刻槽深度和宽度随着脉冲重复频率、工作电流和刻划速度的变化规率。

Laser scribing of InSb wafer was studied and the relationship between process parameters ( pulse frequency , electrical current and traverse speed ) and groove depth and width has been obtained .

研究了利用调QNd：YAG激光对InSb的激光划片，得出了刻槽深度和宽度与脉冲重复频率之间的关系。

Laser scribing of InSb with a Q switched Nd : YAG laser was studied in this paper and the relationship between pulse frequency and groove depth and width has been obtained .

复合膜的厚度均匀性是影响工件切割缝宽度的主要原因。（2）研制出的超薄金刚石-镍复合膜切割片（51×0.025×40mm）能满足划片工艺要求。

The main reason which determined the width of cut slot was the uniformity of thickness of the film . ( 2 ) The prepared super-thin cutting blade was tested for cutting silicon slice , which indicated that the blade can fulfil the need of cutting technics .

划片机气静压电主轴热态特性研究

Study on Air Spindle 's Thermal Characteristic in the Dicing Saw

全自动划片机中CAN总线节点设计与实现

Design and Realization of CAN node for Full Automatic Dicing Saw

薄片划片微损伤与芯片断裂强度探讨

Study on Microdamage of Thin Wafer Sawing and Die Break Strength

划片机气静压电主轴热变形的有限元分析

FEA of Thermal Deformation for Air Spindle of Dicing Saw

射频激光对氧化铝陶瓷基片划片的研究

Study on laser scribing of Al_2O_3 ceramic substrate with RF CO_2 laser

砂轮划片机刃具修整数学模型分析

The Mathematic Model Analysis On Dicing Saw 's Blade Dressing

精密砂轮划片机的设计及精度分析

Design and Accuracy Analysis of Precision Sand-wheel Slice Cutting Machine

从划片机的划切机理出发建立数学模型；

This paper establish mathematic model according to Dicing Saw 's cutting principle ;

划片机视觉识别系统设计原理分析

The Analysis of Design Principles for the Dicing Saw 's Vision Recognition System

直线电机在划片机中的应用

The Application of Linear Motor in Dicing Machine

介绍了伺服系统在砂轮划片机中的应用情况。

The application of a servo system in the ZSH5 dicing saw was introduced .

沁河砂石资源分段划片管理模式的探索

Probe into Management Model in Sections and Patches in Qin River Sand and Stone

该系统主要有学校宏观划片、微观规划和片区拆迁等功能。

The system functions mainly include macro dicing , micro planning and district demolition .

砂轮划片机θ向机构和传动误差分析

Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw

划片机双真空吸附功能的实现

Realization of Incision Machine 's Double-vacuum Adsorption

基于就近原则的中小学招生划片系统设计与实现

Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle

划片试验后刀片保持锋利，无翘曲等变形。

Blades maintain sharp shape , have few warps and little deformation after the experiments .

自动砂轮划片机要求的定位精度为10μm/200mm，分配给机械系统的误差是7μm，机械零部件的公差都是依此进行设计的。

The positioning accuracy required by the automatic sand-wheel slice cutting machine is 10um / 200mm .

激光陶瓷划片工艺研究

Technology of Laser Marking Ceramics Plate

聚晶层的激光划片

Laser scribing of polycrystal layers

通常情况下，微灌系统规划设计都采用轮灌的工作制度，即按照设计的轮灌组划片限灌。

In usual condition , the work system of alternation irrigation is adopted in the micro-irrigation system design .

根据微电子工业的发展现状，论述发展全自动划片机的必要性；

The necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry .