划片机

划片机视觉识别系统设计原理分析

The Analysis of Design Principles for the Dicing Saw 's Vision Recognition System

从划片机的划切机理出发建立数学模型；

This paper establish mathematic model according to Dicing Saw 's cutting principle ;

YAG调Q激光陶瓷基板划片机

Ceramic Substrate Nd : YAG Q-Switching Laser Cutter

划片机气静压电主轴热态特性研究

Study on Air Spindle 's Thermal Characteristic in the Dicing Saw

全自动划片机中CAN总线节点设计与实现

Design and Realization of CAN node for Full Automatic Dicing Saw

划片机气静压电主轴热变形的有限元分析

FEA of Thermal Deformation for Air Spindle of Dicing Saw

砂轮划片机刃具修整数学模型分析

The Mathematic Model Analysis On Dicing Saw 's Blade Dressing

精密砂轮划片机的设计及精度分析

Design and Accuracy Analysis of Precision Sand-wheel Slice Cutting Machine

直线电机在划片机中的应用

The Application of Linear Motor in Dicing Machine

介绍了伺服系统在砂轮划片机中的应用情况。

The application of a servo system in the ZSH5 dicing saw was introduced .

砂轮划片机θ向机构和传动误差分析

Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw

划片机双真空吸附功能的实现

Realization of Incision Machine 's Double-vacuum Adsorption

自动砂轮划片机要求的定位精度为10μm/200mm，分配给机械系统的误差是7μm，机械零部件的公差都是依此进行设计的。

The positioning accuracy required by the automatic sand-wheel slice cutting machine is 10um / 200mm .

根据微电子工业的发展现状，论述发展全自动划片机的必要性；

The necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry .

本文介绍了中科院长春光机所自行研制的划片机的研制过程。

The paper introduces development of wafer incision machine made by Changchun Institute of Optics and Fine Mechanics and Physics .

而划片机是集成电路的后封装的重要一道工序，它的加工能力决定了芯片的质量和数量。

Dicing saw is an important process of the IC after package , its processing capacity determine the quality and quantity of chips .

本文介绍了在精度理论指导下进行的砂轮划片机机械系统的设计。

The design of mechanical system of sand-wheel slice cutting machine , under the direction of precision theory , is introduced in this thesis .

从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；

The key technologies of Auto dicing saw , such as air spindle , transfer and orientation of wafer , automatic alignment and automatic wash are analyzed .

为满足快速发展的市场需求，我们研制了一种新型的太阳能电池划片机&自动砂轮划片机。

To meet the expending market requirement , we have developed a new type of slice cutting machine for solar battery production , which is called sand-wheel slice cutting machine .

自动对准技术是集成电路后封装设备中的一项重要单元技术，是全自动划片机与普通划片机的最大区别之一。

The automatic alignment technique is a key part in the development of IC packaging equipment , which brings the dicing saw new bright spot contrast to the general saw .

随着超薄晶圆切割加工工艺要求的不断提升，水导激光晶圆切割工艺能够比较好地克服传统划片机以及激光干切晶圆所带来的负面影响，达到良好的切割效果的特性，引起越来越多的关注。

Under the circumstances that the requirement for ultra-thin silicon dicing process is becoming higher and higher , water guide laser wafer dicing process can better overcome the adverse affects of traditional dicing saw as well as silicon-cutting only with laser and achieve good dicing effects .

在太阳能电池生产中有一道工序叫划片，而划片机是划片工序中必备的关键设备之一。

Slice cutting is a procedure in the production of solar battery while slice cutting machine is one of the necessary equipments in this procedure .