光刻加工
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用FIB/EB混合光刻加工GaAsFET蘑菇栅
GaAs FET Mushroom Gate Fabricated by FIB / EB Hybrid Lithography
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微机械制造中的三维立体光刻加工技术
3-D Lithography Technology in Manufacturing of Micro - machines
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本文借鉴人体内呼吸循环系统的分形结构,利用微电子机械光刻加工工艺,设计制造了一套新型分形树状微通道微电子芯片散热器。
In this paper , a new fractal tree-like microchannel heat sink for cooling of electronic chips was fabricated on silicon wafers by advanced MEMS technology .
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环氧基负性光刻胶加工微结构的试验研究
Fabrication of micro-structure by using epoxy-based negative photoresist
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激光光刻是加工微光学及二元光学掩模的主要手段。
Laser lithography is one of the main methods for manufacturing micro-optical and the binary optical masks .
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准分子激光在激光光刻和微细加工中有广泛的应用,要求激光具有好的稳定性和光束波面均匀性。
As widely applied in laser lithography and laser micromachining , excimer laser should have high stability and uniformity of beam intensity profile .
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激光无膜光刻技术具有加工精度高、加工分辨率高和可加工特征尺寸小的特点,适合于微小零件和零件微小特征的加工。
Laser maskless lithography technology has high machining precision , high resolution , and small processing feature sizes , which is suitable for the processing of small parts .
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KrF准分子激光移相光刻在HEMT栅加工中的应用
KrF Excimer Laser Phase-shifting Lithography in HEMT Fabrication
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随着光刻技术在微加工领域的广泛应用,如何有效地测试和评价准分子激光光学系统已经成为光刻技术研究中的关键问题。
With the wide applications of laser lithography in laser micro machining fields , measuring and evaluating optical system of laser lithography obtains intensive attentions .
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随着光刻、激光微加工以及激光光谱仪的发展,紫外与深紫外光谱区的相干光源变得越来越重要。
Coherent light sources in the deep and vacuum UV ( DUV and VUV ) spectral regions become more important with the development of photolithography , laser micro-machining as well as laser spectroscopy .
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功率半导体器件芯片制造过程中实际上就是在衬底上多次反复进行的薄膜形成、光刻与掺杂等加工过程,其首要的任务是解决薄膜制备问题。
Power semiconductor device chip manufacturing process is actually repeated several times on film formation , lithography and doping process in a substrate , and its primary task is to solve the problem of film formation .
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根据光刻胶的反差的经验公式,提出了曝光剂量与刻蚀深度关系的计算方法,减少了实验次数和由于测量带来的误差,而且为电子束光刻的三维加工提供了重要参数。
The calculation method of relation between the dose and depth is proposed according to the experiential formula of resist contrast . The calculation not only reduces experimental time and measurement error , but also provides significant parameters for 3D microfabrication . 3 .