软钎料
- soft solder;low melting solder
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ICP-AES测定软钎料中杂质铅和铁
Determination of Impurity Lead and Iron in Soft Solder by ICP-AES
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陀螺仪壳体钎焊软钎料润湿性研究
Study on Wettability of Soft Solder in Gyro - Housing Soldering
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通过酸度溶解试验、干扰实验等,建立了ICP-AES测定软钎料中杂质铅和铁的分析方法。
A method was established for determination of impurity lead and iron in soft solder alloy by ICP-AES .
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Zn对Sn-Ag-Bi系软钎料钎焊性能影响的研究
Effect of Zn on the Solderability of the Sn-Ag-Bi Solders
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高强度ZA合金软钎料的研制
Research on High - strength ZA Alloy Solders
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Sn-Zn系电子无铅软钎料湿润性能的研究
Wettability of Sn-Zn System Lead-free Electronic Solders
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故在Sn-Ag近共晶无铅软钎料中Bi的添加量,应加以适当的控制。
Therefore , the Bi content should be limited to some degree in the research and development of the new Sn-Ag lead-free solders .
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Sn-Ag系电子无铅软钎料的超电势研究
Overpotential Research of Sn-Ag System Electronic Solders
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结果表明,用研制的新型高强软钎料钎焊高强度ZA合金获得的钎焊接头在界面区局部有交互结晶产生;
The results show that interactive crystallization exists in the interfacial region by using a new developed high strength soldering filler metal .
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ZL102合金用低温软钎料的研究
Study on Solder of Low Temperature for ZL 102
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讨论了电子软钎料的钎焊性能及其影响因素,并采用铺张面积法对Sn-Zn-Ag系钎料钎焊性能进行评估。
The solderability of electronic solders and effect of some factor on the solder ability were discussed . And the test method of spreading areas was used to evaluate the solderability of the Sn-Zn-Ag family of solder .
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基于环保和可持续发展,本文概述了SnAg、SnZn、SnBi、SnCu、SnSb等系列Sn基无铅软钎料研究成果,分析了电子工业用无铅钎料的可靠性问题。
Considering environmental protections and sustainable development , the research conclusions of Sn-based Lead-free solders series ( such as SnAg 、 SnZn 、 SnBi 、 SnCu 、 SnSb et al ) are illustrated in this paper . Reliability of electronic Lead-Free Solders was also analyzed .
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无铅软钎料国内外的研究动态与发展趋势
Research and development trend of lead-free solder alloy at home and abroad
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电子表面封装无铅软钎料的研制
The Research and Development of Pb-free Solders for Electronic Surface Mount Technology
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多元无铅软钎料的计算机优化设计
Optimal design of multi-element lead-free soft solder with computer
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无铅软钎料的研究现状与展望
Current Status & Prospect Of Lead-Free Solder Alloy
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无铅软钎料的新进展
New Development of Lead-free Solders
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引入了快冷锡基软钎料的浸润性模型,并进行了计算处理。
A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed .
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软钎焊钎料的最新发展动态
The New Development in Solder Alloys