软钎料

ruǎn qiān liào
  • soft solder;low melting solder
软钎料软钎料
软钎料[ruǎn qiān liào]
  1. ICP-AES测定软钎料中杂质铅和铁

    Determination of Impurity Lead and Iron in Soft Solder by ICP-AES

  2. 陀螺仪壳体钎焊软钎料润湿性研究

    Study on Wettability of Soft Solder in Gyro - Housing Soldering

  3. 通过酸度溶解试验、干扰实验等,建立了ICP-AES测定软钎料中杂质铅和铁的分析方法。

    A method was established for determination of impurity lead and iron in soft solder alloy by ICP-AES .

  4. Zn对Sn-Ag-Bi系软钎料钎焊性能影响的研究

    Effect of Zn on the Solderability of the Sn-Ag-Bi Solders

  5. 高强度ZA合金软钎料的研制

    Research on High - strength ZA Alloy Solders

  6. Sn-Zn系电子无铅软钎料湿润性能的研究

    Wettability of Sn-Zn System Lead-free Electronic Solders

  7. 故在Sn-Ag近共晶无铅软钎料中Bi的添加量,应加以适当的控制。

    Therefore , the Bi content should be limited to some degree in the research and development of the new Sn-Ag lead-free solders .

  8. Sn-Ag系电子无铅软钎料的超电势研究

    Overpotential Research of Sn-Ag System Electronic Solders

  9. 结果表明,用研制的新型高强软钎料钎焊高强度ZA合金获得的钎焊接头在界面区局部有交互结晶产生;

    The results show that interactive crystallization exists in the interfacial region by using a new developed high strength soldering filler metal .

  10. ZL102合金用低温软钎料的研究

    Study on Solder of Low Temperature for ZL 102

  11. 讨论了电子软钎料的钎焊性能及其影响因素,并采用铺张面积法对Sn-Zn-Ag系钎料钎焊性能进行评估。

    The solderability of electronic solders and effect of some factor on the solder ability were discussed . And the test method of spreading areas was used to evaluate the solderability of the Sn-Zn-Ag family of solder .

  12. 基于环保和可持续发展,本文概述了SnAg、SnZn、SnBi、SnCu、SnSb等系列Sn基无铅软钎料研究成果,分析了电子工业用无铅钎料的可靠性问题。

    Considering environmental protections and sustainable development , the research conclusions of Sn-based Lead-free solders series ( such as SnAg 、 SnZn 、 SnBi 、 SnCu 、 SnSb et al ) are illustrated in this paper . Reliability of electronic Lead-Free Solders was also analyzed .

  13. 无铅软钎料国内外的研究动态与发展趋势

    Research and development trend of lead-free solder alloy at home and abroad

  14. 电子表面封装无铅软钎料的研制

    The Research and Development of Pb-free Solders for Electronic Surface Mount Technology

  15. 多元无铅软钎料的计算机优化设计

    Optimal design of multi-element lead-free soft solder with computer

  16. 无铅软钎料的研究现状与展望

    Current Status & Prospect Of Lead-Free Solder Alloy

  17. 无铅软钎料的新进展

    New Development of Lead-free Solders

  18. 引入了快冷锡基软钎料的浸润性模型,并进行了计算处理。

    A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed .

  19. 软钎焊钎料的最新发展动态

    The New Development in Solder Alloys