真空电子

微波功率模块：RF真空电子技术的新发展

MPM : Advance in RF Vacuum Electronics

微加工技术为真空电子技术的发展提供了新的领域和新的应用。

Recent developments in microfabrication have produced new opportunities in vacuum electronics .

真空电子束焊机中的PLC应用技术

Application of PLC Technology in the Vacuum Electron Beam Welder

SiC颗粒增强铝基复合材料的真空电子束焊接

Vacuum electron beam welding of SiC particle reinforced aluminum matrix composites

真空电子器件用Al2O3陶瓷

Alumina Ceramics for Vacuum Electronic Device

使用高真空电子束蒸发在p型Si（100）衬底上制备了高kHfO2薄膜。

High k dielectric HfO 2 films were deposited on p type Si ( 100 ) substrates by e beam evaporation .

固／液界面电化学体系与超高真空电子能谱双向转移及其研究系统的建立和对Pt／Bi（ad）电极表面化学状态的研究

Establishment of New Research System to Combine Electrochemistry and Electron Spectroscopy and the Investigations of Surface Chemical States of Pt / Biad Electrode

由于其特殊的结构，四角状ZnO一维纳米结构在真空电子器件方面有很好的应用前景。

Our results demonstrated that tetrapod-like ZnO 1D nanostructures have potential application in the field of vacuum electron devices arising from the special structure .

用于真空电子器件的非ODS水剂清洗工艺

Non-ODS Aqueous Cleaning Technique for Vacuum Electron Components

超高真空电子束蒸发合成晶态AlN薄膜的研究

Synthesis of AlN films by nitridation of Al films evaporated on si ( 100 ) substrate by UHV electron beam

用高真空电子束蒸发方法制备了以半导体材料Si为过渡层的Co／Cu／Co三明治膜并研究了其巨磁电阻效应。

The Co / Cu / Co sandwiches with an amorphous Si buffer layer were prepared by high vacuum electron beam evaporation . The giant magnetoresistance ( GMR ) effect in these sandwiches was studied .

介绍了应用真空电子束焊接方法对Zr-4合金定位格架进行的焊接工艺研究。

The welding technology for Zr-4 alloy spacer grid by using vacuum electron beam was studied .

结果表明Zr-4合金定位格架应用真空电子束焊接是可行的。

The experimental results indicated that the Zr-4 alloy spacer grid welded by vacuum electron beam welding is feasible .

笔者认为：BeO瓷在近期相当一段时期内，仍然是大功率真空电子器件领域内最为广泛应用的高热导率陶瓷。

It is believed that the BeO ceramic will still have a most wide application in the near future .

确定了一套完整的54cmFS高真空电子器件金属零件化学研磨工艺。

A kind of chemical grinding process for metal parts of 54 cm FS high-vacuum electronic devices was determined .

通过金相技术、力学性能试验和SEM技术研究了6061-T6铝合金真空电子束焊接接头的金相组织、力学性能和断口形貌特征。

The metallurgical structures , mechanical properties and fractographs of EB welded 6061-T6 aluminum alloy joint were studied by means of metallography , mechanical test and SEM technology .

BNi-2钎料真空电子束钎焊

Vacuum Electron Beam Brazing With BNi - 2

采用超高真空电子束蒸发方法在硅单晶衬底上制备了Co／Cu／Co三明治膜，研究了衬底晶向、过渡层材料和生长室温度对三明治膜中巨磁电阻效应的影响；

Co / Cu / Co sandwiches were fabricated on crystalline silicon substrate by UHV electron beam evaporation . The influence of substrate orientation , material of buffer layer and fabrication temperature on the giant magnetoresistance ( GMR ) effect in the sandwiches was studied .

自从20世纪50年代以来，计算方法在理解和研制真空电子器件及其相应的高功率器件（如HPM管）方面一直起着关键性的作用。

Since 1950s , the calculation method has played a pivotal role in the understanding and development of electronic vacuum devices and their corresponding high-power devices ( such as the HPM ) .

真空电子器件用V-B系列钎料研究

Research on A Series of V-B Solder Used in Vacuum Electronic Devices

本文采用真空电子束蒸镀技术在多谱段ZnS衬底上沉积了适合金刚石膜沉积的致密陶瓷过渡层，并利用微波等离子体CVD金刚石膜低温沉积技术进行了金刚石膜沉积研究。

In the present investigation , a ceramic interlayer suitable for diamond film deposition on multi-spectra ZnS substrate was prepared by electron beam evaporation . Diamond film deposition was conducted using microwave plasma CVD method and the low temperature deposition technique .

采用小孔法对TC11平板真空电子束焊接接头的残余应力进行了测量。

A hole drilling method was used to determine the residual stresses in electronic beam welding ( EBW ) joint of TC11 titanium alloy plate .

介绍了TC-436N/O测定仪的结构、原理及其在真空电子材料中的应用，着重对无氧铜、Cr-Cu合金中的N，O气体含量测定，作了较多的论述。

In this paper , the structure , principle of the TC-436 nitrogan / oxygen determinator and its application in vacuum electron materials research are introduced . The determination of nitride and oxide contents of OFHC copper and Cu-Cr alloy are described especially .

采用微电子平面工艺，高真空电子束蒸发金属Au做肖特基接触，多层金属Ni、Ti、Ag合金在背底上做欧姆接触，制作出Au／n-4H-SiC肖特基势垒紫外光电二极管（Uv-SBD）。

With microelectronics plane technology , electron beam evaporation is used to deposit metal Au on the surface of n-4H-SiC to form Schottky contact , alloys Ti . Ni . Ag used to form Ohmic contact on the n + backside , the Schottky barrier ultraviolet photodiode has been fabricated .

WO3电致变色薄膜采用真空电子束蒸发技术制备，采用光学膜厚极值法和石英晶体振荡法膜厚测量技术监控WO3薄膜的膜厚及其光学特性。

The WO_ ( 3 ) electrochromic film was prepared using electron beam evaporation . The thickness and optical characters of WO_ ( 3 ) films were controlled by the extremum method of optical film thickness measure technology and the method of crystal oscillation thickness measure technology .

本研究是采用爆炸焊和真空电子束自钎焊两种工艺制成Nb-1Zr合金和不锈钢的焊接结合层，并对爆炸焊工艺的焊接结合层进行了1000℃～1300℃不同时间的高温真空退火处理。

Explosive welding and vacuum electron beam self-material brazing were used to prepare the specimen . The explosive welding specimen were also annealed in vacuum at various elevated temperature from 1000 ℃ to 1300 ℃ .

研究了Zr-Sn-Nb-Fe-Cr锆合金真空电子束焊接样品的拉伸和抗腐蚀性能，结果表明，焊接样品室温和375℃的拉伸性能略低于母材；

The mechanical properties and corrosion resistance of the sample made by vacuum electron bean welding of Zr-Sn-Nb-Fe-Cr zirconium alloy were investigated . The results show mechanical properties at room temperature and 375 ℃ temperature of welding sample were lower than matrix .

探讨了真空电子束钎焊过程中电子束钎焊工艺参数对钎料润湿性和试板温度场的影响作用，以及BNi-2钎料钎焊不锈钢时的接头组织。

Effects of processing parameters on wettability of filler metal and temperature field characters of test plates during vacuum electron beam brazing ( VEBB ) and microstructure of stainless steel joint brazed with BNi - 2 filler metal are investigated in this paper .

为适应大功率微波真空电子器件对大电流密度、高稳定性热阴极的发展要求，本论文研制了一种新型双层膜钡钨阴极（Os-W／Re和Os-Ru／Re双层膜钡钨阴极）。

A new type of dispenser cathode with dual-layer ( Os-W / Re and Os-Ru / Re ) has been developed in order to meet the high electron emission and reliability requirements of high power microwave electron devices for electron emitters .

精密数控高真空电子束焊机的研制

Development of precision numericed controlled high vacuum electron beam welding machine