电迁移效应
- 网络electromigration effect
电迁移效应-
无铅焊料的研究（4）&电迁移效应
The Research of the Lead & free Solder for Electromigration
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当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
As an electric current passes through , the Joule heating and electromigration effects occur in the flip chip solder bumps .
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这主要是由于电流引起了熔体中的电迁移效应及电流在熔体中偏聚引起焦耳热效应所导致的枝晶熔断所致。
That 's mainly because the electric current promoted the effect of electrical migration and the convergence of the electric current in the melt , which resulted in the joule heat effect and fusing the arm of dendrite .