基本工艺

  • 网络Basic process;Basic Technology;Basic Craft
基本工艺基本工艺
  1. 模具是制造业的一种基本工艺装备,它的作用是控制和限制材料(固态或液态)的流动,使之形成所需要的形体。

    The molding tool is a kind of basic craft material of manufacturing industry , its function is the fluxion of control and restriction material ( solid or liquid ) and make of the body needed by formation .

  2. 热油管道的基本工艺特性

    The Characteristic of the Basic Technology for Heated Oil Pipelines

  3. 在对渗铝钢管进行金相、SEM和能谱分析后,确定了热浸渗铝的基本工艺参数。

    By metalloscope , SEM and spectrometer , the basic technical parameters of hot dipping alumetizing were obtained .

  4. 1万t多品种DBP增塑剂基本工艺流程设计

    The Basic Process Design of Ten Thousands Tons of Varieties of DBP Plasticizer

  5. 本文介绍了用直接凝固注模成形法制备Al2O3基陶瓷材料的基本工艺过程;

    The basic processing of Al 2O 3 based ceramics moulding by direct coagulation casting is reported in this paper ;

  6. 介绍了马钢90tLF-VD(EMS)钢包精炼炉处理车轮轮箍钢的基本工艺情况。

    The 90 t LF-VD ( EMS ) refining process for wheel and tyre steel is introduced in this paper .

  7. 从固色温度、色浆pH值、尿素用量等方面,分析了锦纶织物弱酸性染料印花的基本工艺。

    The general printing process of polyamide fabric with weak acid dyes was analyzed from fixing temperature , pH value of color paste and dosage of urea to fixation yield .

  8. 概述了集成电路(IC)生产的基本工艺流程及其关键设备的国际国内水平,展望了IC制造工艺设备的发展趋势;

    Summarize the basic process flow of IC production and the International and internal level of its key equipment , prospecting the trend of IC process equipment .

  9. 本文介绍了全自动粘箱机的基本工艺和流程,并通过研究设计一套基于PLC控制的粘箱机控制系统。

    This paper introduces the basic automatic sticky box machines , and technology and processes through research design a set of sticky box based on PLC machine computer control system .

  10. Zn扩散是制备GaSb(热)光伏电池的基本工艺之一。

    The Zn diffusion process was found to be a very suitable process for producing GaSb ( Thermo ) photovoltaic cells .

  11. 本文介绍国内外ESL乳生产的基本工艺及陶瓷膜微滤除菌、离心除菌和CO2填充等技术在ESL乳生产中的应用。

    In this paper , the basic processing and several new technologies such as microfiltration , adding CO2 , centrifugal separation were introduced .

  12. 本文还提及了互补MOS(CMOS)的基本工艺和部分与可变电容有关的工艺以及射频器件的测试方法。

    In addition , some basic measurement techniques about varactor , standard Compensation-MOS ( CMOS ) process and the detailed process for varactor are described in details .

  13. 详细介绍MIM粘结永磁和烧结磁体的基本工艺过程及基本要求。

    The processing and its requirement on manufacturing bonded permanent magnets and sintered magnets by MIM are discussed in detail .

  14. MCM-C组装封装基本工艺流程研究

    The Research of Basic Technological Process of MCM-C Assembly Packaging

  15. 本文阐述了用过渡液相扩散连接方法焊接K3镍基铸造高温合金的基本工艺。

    The essential technology to we 'd K3 nickel-based super alloy using transition liquid diffusion bonding is described .

  16. 介绍了在低温烧结炉中,生产出适于制作钼电极的大规格(Φ80mm)烧结棒的基本工艺。

    Big sintered bars (Φ 80mm ) for making molybdenum electrodes have been produced in a low-temperature sintering furnace .

  17. 接着对彩涂板生产线的基本工艺进行了概述,并提出了该控制系统的总体设计方案,包括电气传动设计方案,基础自动化设计方案以及基于PROFIBUS现场总线设计方案;

    After that the paper introduces the basic color coat technology and gives the general electric design scheme , including electric drive systeme , base automation design project and field bus project based on PROFIBUS .

  18. 研究了水浴溶液的pH值、温度、各反应物溶液的浓度和滴定硫脲与倾倒硫脲等基本工艺参数对CdS薄膜结构特性的影响。

    Researches are made on the influence of the fundamental parameters including pH , temperature , and concentrations of the solution involved in the chemical bath deposition of CdS and titration or dumping of the thiourea solution on the structure characteristic of CdS thin films .

  19. 研究喷枪往复机构与头盔自转机构的运动关系,并运用ADAMS软件来分析其运动轨迹特性,从而确定最佳的头盔喷涂轨迹和真空静电喷涂头盔的基本工艺参数。

    Studying the movement relationship between the reciprocating mechanism and the rotation mechanism . Analyzing their trajectory characteristics by ADAMS software , so as to determine the best helmet spraying trajectory and the basic technological parameters of the vacuum electrostatic spraying for helmet .

  20. 概述了金属注射成形(MIM)技术的基本工艺过程及其特点,从几种MIM典型工艺分析入手介绍了MIM技术的发展状况,最后介绍了该技术在兵器工业中的应用。

    The Processes and characteristics of metal injection molding MIM technology were described . Then the development of MIM technique was introduced by analyzing several typical MIM Processes . And finally the application of MIM in ordnance industry was briefed .

  21. 在简要介绍我所现有的低温共烧陶瓷(LTCC)型陶瓷多芯片组件(MCM-C)主要组装工艺技术和常用封装型式的基础上,重点进行MCM-C组装封装基本工艺流程的设计研究。

    On the foundation of the introduction of our institute existing LTCC type MCM-C main assembly technologies and packing styles usually used , the paper emphasizes the design research of the MCM-C assembly packing basic technological process .

  22. 本文给出了所研制的双扩散垂直沟道3DOV型高频功率场效应晶体管的设计原理、公式和基本工艺要则。

    The design considerations , fabrication and electrical characteristics of VVMOS high-frequency power field-effect transistors ( type 3DOV ) using double-diffusion technology are given .

  23. 通过对现有SCFE基本工艺及原理的分析,提出了小型SCFE系统工艺,并进行系统设备配置,同时用断裂力学理论对SCFE系统关键设备&高压萃取釜进行疲劳寿命估计。

    Based on analysis of existing basic SCFE technique and principle , a minitype SCFE system is developed and the theory of rupture mechanics is applied to estimate of fatigue life on the SCFE key part high pressure extractor .

  24. 科学设计并完成了电解加工基本工艺试验。

    Basic operating examinations of ECM are scientifically framed and done .

  25. 论述了其基本工艺过程和技术上的可能性及经济上的合理性。

    The process and feasibility of technology and economic rationality were discussed .

  26. 压铸涂料基本工艺性能及检测技术的探讨

    Research on the Main Characteristics and Detecting Method of Die Casting Coating

  27. 冷冻铸造及其基本工艺技术问题

    Freeze Casting Process and its Basic Process Principle and Methods

  28. 腈纶表面接枝蛋白质改性的基本工艺过程与效果

    Process and Effect of Modification on Polyacrylonitrile Fiber by Protein Surface Grafting

  29. 低频扭转振动攻丝基本工艺参数组研究

    Study on the Basic Technological Parameter Set in Low Frequency Torsional Vibration Tapping

  30. 浓缩茶浸取基本工艺参数研究

    Study on the basal soaking parameters of concentrated tea