基板材料

文章对日本近年在高性能PCB基板材料用新型环氧树脂的品种、性能及应用进行了阐述。

Recent variety , performance , application of Japanese new epoxy resin used in high performance PCB base material were reviewed .

挠性PCB用基板材料的新发展（2）&三层型挠性覆铜板的开发新成果

The Newest Progress of Base Material used in Flexible PCB ( 2 ) & New Achievements of the Development of Three-layer Type FCCL

比较几种大功率LED封装基板材料

Comparing Some Packaging Board Materials for Large Power LED

臭氧发生器用Al2O3陶瓷基板材料的改性研究

Study on the al_2o_3 ceramic plate material modifier for ozonizer

根据硬盘基板材料的发展趋势选择了Li2O&SiO2系统微晶玻璃作为硬盘基板用微晶玻璃。

The following works are done : Li2O-SiO2 system glass-ceramic be chose as material which used as HDD substrate .

PCB基板材料用新型环氧树脂发展综述

Development of New Epoxy Resin for PCB Base Materials

日本PCB基板材料业的市场转变与产品发展

Transformation of Market and Progress of Product about PCB Substrate Material in Japan

高速、高频PCB用基板材料评价与选择

Evaluation and Selection of High Speed and High Frequency Substrate Material Used in PCB

PCB基板材料技术新进展&2002年日本七项PCB基板材料的新成果

New Progress of PCB Substrate Material & New Achievement for Japanese seven terms substrate material in 2002

AlN陶瓷基板材料热导率与烧结助剂的研究进展

Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material

本连载文章，以近一两年发表的日本专利为对象，研究、综述了日本PCB基板材料业在制造技术上的新发展。

The article had summarized mostly the manufacturing technology about PCB substrate material fitting for drilling of CO_2 laser .

低介电常数性与低介质损失因数，是PCB基板材料实现高速化、高频化的重要性能项目。

Low dielectric constant and low dissipation factor are important properties to achieve high speed and high frequency of PCB substrate .

然而，氧化铝陶瓷的烧结温度和谐振频率温度系数τf，限制了它作为低温烧结基板材料的进一步发展。

However , the high sintering temperature and the temperature coefficient of resonant frequency (τ _f ) limited its farther development as low-temperature sintered substrate ceramics .

BUM所用基板材料的新发展，作以阐述和分析探讨有关规律性方面东西。

The newest development of substrate material in BUM .

Mg4Nb2O9具有与α-Al2O3相同的刚玉型晶体结构，可望成为新一代高Q、低ε基板材料。

Mg_4Nb_2O_9 has the same crystal structure of α - Al_2O_3 and can be developed as a new type high-Q , low - ε substrates material .

在玻璃陶瓷基板材料中加入PS有机球能有效地降低基板的介电常数，但同时影响基板的抗折强度。

The addition of PS can reduce the dielectric constant of glass-ceramic substrate materials effectively , but reduce the flexural strength at the same time .

共面波导（CPW）在太赫兹频段的特性分析与基板材料选择

Transmission Characteristics of Coplanar Waveguides and Choice of Substrate Materials at Terahertz Frequency

以Si3N4粉末作为增强组分与环氧树脂进行复合，采用模压法制备了氮化硅/环氧树脂复合电子基板材料。

A kind of composite substrate was fabricated using Si_3N_4 powder as filler and epoxy as matrix and employing the method of press molding .

本文采用简化的等效封装模型，对几种基板材料的等效热阻进行计算，用计算结果来进行比较，从而选择出更为合适的可用于封装大功率LED的基板材料。

In the paper , the simplified equivalent model is established to calculate the equivalent thermal resistance of several board materials , and by comparing the calculation results , the even more suitable packaging board material is found out .

新开发的低损耗、低介电常数的低温共烧陶瓷（LTCC）材料最适合做微波MCM的基板材料。

The newly developed low loss , low dielectric constant and low temperature co fired ceramics ( LTCC ) materials are the best substrate for microwave MCM technology .

本文综述了日本PCB基板材料制造业根据市场的新变化，发展高性能、高附加值的基板材料的最新动向。

Abstract In the paper , the recent transformation of market about PCB substrate manufacture in Japan was reviewed . At the same time , the newest development of high-performance and high profits substrate was introduced .

AlN陶瓷因为具有高的热导率，低的介电常数，与Si相匹配的热膨胀系数，良好的绝缘性，热化学稳定性好，无毒等优点，成为高密度集成电路基板材料的最佳选择。

As a promising packaging substrate , AIN ceramics attract particular interest due to its specific properties of high thermal conductivity , low dielectric constant , a matching thermal expansion with silicon , good thermo-chemical stability and nontoxic .

微条气体室（MSGC）基板材料的研究

Research on the substrate materials of micro-strip gas chambers

世界覆铜板新产品新技术赏析（6）&松下电工汽车PCB用基板材料R-1755D

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide ( 6 ) & Base Material R-1755D for Automobile PCB from Matsushita Electric Works

叙述了硬盘盘片的发展方向及对其基板材料的要求。

The developing trend of disc of Hard Disk was expounded .

液晶聚合物膜基板材料的应用

Application of Using Liquid Crystal Polymer Film for Base Material

印制电路用基板材料业百年发展回顾

The Retrospect of a Century of Development of PCB Used Base Material

液晶聚酯与氮化铝复合基板材料的研究

Study on the composite of aluminum nitride powder and liquid crystalline polyester

氮化硅/环氧复合电子基板材料制备及性能

Fabrication and performance of Si_3N_4 / epoxy composite used for electronic substrate

计算机硬盘基板材料的研究

The research of the substrate materials for the hard disks