热界面材料

尽管存在以上优势，Si纳米线热电材料的热电转换效率还不足以大规模应用，而由于界面热阻的存在，碳纳米管热界面材料的散热效率也比较低。

Despite of the advantages above , the thermoelectric conversion efficiency of Si nanowire thermoelectric materials is not enough for widespread applications and the efficiency of heat dissipation in carbon nanotube thermal interface materials is also not high enough due to existence of interfacial thermal resistance .

热界面材料的好坏，决定了电子产品的优劣。

The quality of thermal interface materials determines the quality of electronics .

热界面材料的特性及其应用

The Characters of Thermal Interface Materials and Its Application

本文研究了新型热界面材料低温烧结纳米银焊膏薄膜的高温蠕变行为。

The creep behavior of nano-scale silver paste has been investigated in this thesis .

目前市场上热界面材料主要有导热硅脂类、导热凝胶和相变材料。

The main thermal interface materials in the market are thermal grease , thermal gel , and phase change materials .

随着大功率电子元器件的发展，电子行业对热界面材料的要求越来越高。

With the development of high-power electronic components , thermal interface materials play an important role in the electronic industry .

电子封装领域中的热界面材料在集成芯片和其他元器件的散热方面起着至关重要的作用。

Thermal interface materials play an important role for the heat dissipation of integrated chips and other elements in electronic packaging .

低温烧结纳米银浆作为一种新型的无铅热界面材料，具有其他传统的热界面材料所不具备的高导热性能。

Low-temperature sintered nanoscale silver paste which acts as a kind of thermal interface materials has high heat conducting property which the other thermal interface materials do not possess .

传统的热界面材料如导热胶、合金钎料的导热性能较低，已成为封装中制约热量传导的瓶颈。

The heat-conducting property of traditional thermal interface materials such as thermally conductive adhesive and solder have not been competent , so that they have restricted the heat dissipation .

热电材料能够直接将废热转换为电能，从而提高能源利用效率；热界面材料可以提高电子器件中界面处的散热效率。

Thermoelectric materials can directly convert waste heat to electricity for improving the efficiency of energy utilization , and thermal interface materials can improve the efficiency of heat dissipation across the interfaces of electronics .

广泛使用的粒子填充型热界面材料，具有高热导率、低成本、易操作等优点，可以有效降低封装散热中的界面热阻。

Particle-filled thermal interface materials which are widely used in electronic devices packaging , have the advantages of high thermal conductivity , low cost , easy to operate , etc. , and they can effectively reduce the interfacial thermal resistance in thermal management of packaging .