覆铜箔层压板

印制线路板用无卤型覆铜箔层压板&玻纤布·环氧树脂JPCA-ES-04-2000

Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000

本文介绍了覆铜箔层压板在其生产过程、检测过程与其在PCB生产过程中的各种影响因素及结果。

The article introduce that the kinds of factor and result of CCL in its Producing Process , Testing Process and PCB Producing Process .

新一代高耐热性、高模量、低CTE覆铜箔层压板材料

New Generation High Heat Resistance , High Modulus and Low CTE Copper Clad Laminates

本文采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚（DGEBA），探索出其成熟的工艺路线，此工艺已在苏州树脂厂实现工业化，填补了国内空白。

A basic material for copper clad laminates , diglycidyl ether of bisphenol-A ( DGEBA ) was synthesized through two-step method . The technological process which proved mature had been realized in industry and filled the vacancy of China .

覆铜箔层压板用新型铜箔胶粘剂配方的研究

Study on Formula of New Copper Foil Adhesive for Copper-Clad Laminates

覆铜箔层压板原纸生产工艺的研究及实践

Research and Practice on Production Technology of Copper Foil Board Base Paper

覆铜箔层压板原纸吸水性的影响因素及其控制

Control and affect on capability of water-absorption of copper foil board base paper

GB/T4721-1992印制电路用覆铜箔层压板通用规则

General rules for copper-clad laminated sheets for printed circuits

覆铜箔层压板专用环氧树脂的合成与性能

The Synthesis and Properties of Epoxy Resins Used in Copper Clad Lamin at es

覆铜箔层压板专用双酚A二缩水甘油醚/双氰胺体系的固化反应动力学

Cure kinetics of diglycidyl ether of bisphenol-A / dicyandiamide system for copper clad laminates

金属芯覆铜箔层压板

Metal core copper-clad laminate

覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。

The copper foil board base paper is the fundamental material to product the paper of printing line board , and also is a kind of higher degree special industrial paper .

通过对影响覆铜箔层压板原纸主要因素的分析，结合生产实际提出了控制措施，对该产品的生产有一定的借鉴意义。

This paper analyzed the main influential factors of the copper foil board base paper , and put forward control measures combining with the practice production , which would be valuable to the production of the paper .

采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚，考察了不同反应条件对产物的总氯含量、环氧值、分子量及分子量分布的影响。

A basic material for copper clad laminates , diglycidyl ether of bisphenol A ( DGEBA ), was synthesized through a two step method . The effect of reaction conditions on chloride content , epoxy equivalent weight , molecular weight and its distribution of products was investigated .

GB/T4723-1992印制电路用覆铜箔酚醛纸层压板

Phenolic cellulose paper copper-clad laminated sheets for printed circuits

浅色覆铜箔酚醛纸层压板的研制

Development of Light Colour Phenolic Paper Copper-Clad Laminate

GB/T4724-1992印制电路用覆铜箔环氧纸层压板聚四乙烯玻璃纤维覆铜箔板

Epoxide cellulose paper copper-clad laminated sheets for printed circuits teflon / fiber glass copper-clad laminates

本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺，总结了影响层压板颜色的因素。

This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour .

GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板

Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板

Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits

HDI多层板覆铜箔板生产技术的应用与开发GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板

Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards