倒装焊

底充胶导热系数预测及对倒装焊温度场的影响

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field

建立了倒装焊结构的热传导数学模型，并给出了解析求解过程。

We constructed a mathematical model for heat transfer in the flip chip structure and provided the solving procedure .

与正装LED相比，倒装焊芯片技术在功率型LED的散热方面具有潜在的优势。

In the aspect of thermal dispersion for power LEDs , flip-chip configuration has potential predominance .

倒装焊器件尺寸参数对低k层及焊点的影响

Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability

对各种正装和倒装焊功率型LED芯片的表面温度分布进行了直接测试，对其散热性能进行了分析。

The temperature distribution of power LEDs is measured , and the performance of thermal dispersion is discussed .

设计和分析了InGaAs/GaAs多量子阱SEED中的一种用于倒装焊的新型谐振腔结构。

A new resonant cavity structure of the InGaAs / GaAs MQW SEED arrays has been designed and analyzed .

倒装焊电子封装底充胶分层研究PCB分层设计中控制电磁干扰辐射

Research of underfill delamination of flip chip Restraint of Electromagnetic Interference from PCB Delamination Design

研究表明，焊接层的材料、焊接接触面的面积和焊接层的质量是制约倒装焊LED芯片散热能力的主要因素；

The analytical results show that the solder material , contact area and processing quality of solder layer will be main factors restricting the ability of thermal dispersion for flip-chip configuration LEDs .

介绍了几种当前先进的MEMS封装技术：倒装焊MEMS、多芯片（MCP）和模块式封装（MOMEMS）。

Additionally , several advanced packaging techniques for MEMS : flip chip for MEMS packaging , multichip package and module MEMS are introduced .

MCM倒装焊技术在CMOS-SEED灵巧象素中的应用研究

MCM Flip-chip-bonding Technique Used in Fabrication of CMOS-S EED Smart Pixel

介绍了微机电（MEMS）封装技术，包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。

The technologies of MEMS packaging are introduced , including three promising technologies : wafer level packaging , single-chip packaging and multi-chip packaging , modular MEMS packaging and flip-chip bonding for MEMS packaging .

基于最小能量原理建立了多芯片组件（MCM）倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。

Based on minimal energy principle , Evolving model of flip-chip 3-D shape prediction of MCM is established , and 3-D solder shape is effectively predicted .

然后由实验测得界面裂缝扩展速率和有限元模拟给出的能量释放率，拟合得到可作为倒装焊封装可靠性设计依据的Paris半经验方程。

Then , the half-empirical Paris equation , which can be used as a design base of flip chip package reliability , have been determined from the crack propagation rates da / dn measured and the energy release rates G simulated .

与CMOS-SEED灵巧象素相关的倒装焊工艺

Flip Chip Bond Technique Related to CMOS SEED Smart Pixels

倒装焊（FC）是多芯片组件（MCM）裸芯片焊接的主要方法，也是MCM的一项关键技术，其焊接质量直接影响MCM的性能和可靠性。

Flip chip is not only one of the main bonding method of bare MCM but also a critical technology of MCM . Its solder quality directly affects the performance and reliability of MCM .

CO2气体保护焊封底技术在2.26m二段式煤气炉上的应用采用MILSTD883C热循环疲劳加载标准，通过电学检测方法测定了B型和D型两种倒装焊封装焊点寿命。

APPLICATION OF CO_2 ARC WELDING TO SEAL ROOT PASS OF A φ 2.26m COAL GAS GENERATOR Following thermal cycling loading standard , MIL STD 883C , the life of two types of test chips ( type B and D ) are determined with electrical measure .

结果发现，声学检测不仅对倒装焊底充胶分层敏感，而且随着实验过程的进行，相应的C-SAM图象焊点衬度变化直接与焊点的热疲劳裂纹萌生与生长程度相关。

It can be seen that not only the SAM is highly sensitive on the underfill delamination , but also the fatigue crack initiation and growth is directly coincide to the contrast variation of solder joint in C-SAM images during reliability test .

但倒装焊也带来了很多的问题。

However , FCB also brought a lot of technical problems .

倒装焊焊点中金属元素迁移及组织演变

Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint

倒装焊微电子封装结构参数的概率设计

The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package

热压超声倒装焊工艺研究

A Study on the Process of Thermocompression Ultrasonic Flip Chip

球栅阵列倒装焊封装中的热应变值的测试

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

倒装焊芯片封装中的非接触检测技术

An Overview of Non destructive Inspection in Flip Chip Packaging

模板对倒装焊焊点形态的影响及其可靠性研究

Impact of Stencil for Flip-Chip Shape and Their Reliability Study

BGA/CSP和倒装焊芯片面积阵列封装技术

Area Array Package BGA / CSP flip chip

多芯片组件倒装焊焊点三维形态预测研究

Study on Flip-Chip 3-D Shape Prediction of MCM

机器视觉系统在倒装焊设备中的应用

Application of Machine Vision System in Flip-Chip-Bonding Equipment

倒装焊焊点的可靠性分析

Reliability Analyse of Flip Chip Solder Joint

倒装焊凸点材料及焊盘金属化多目标凸规划凝聚同伦内点算法

Materials and Metallization Considerations for Flip Chip The Aggregate Homotopy Interior-point Method for Multi-objective Convex Programming

裂缝裂隙、缺口或裂缝低成本基板倒装焊底充胶分层裂缝扩展研究

A crack , crevice , or split . Underfill Delamination of Flip Chip on Low-Cost Board