组装密度

探讨了电极表面自组装密度、MB的浓度及杂交液中盐离子浓度等参数对杂交实验的影响。

This paper discusses self-assembly density , MB concentration , salt ion concentration in hybrid solution and other parameters affecting the hybrid experiment .

Si芯片贴装于陶瓷基板可以很好的取代它，既可以提高组装密度，焊点寿命也比前者提高了6倍。陶瓷封装对陶瓷基板搭配是其中可靠性最好的，它的焊点寿命最长。

Sticking the Si chip to the ceramic base plate can replace the former , because it not only raise the density of assembling , but also life-span of solder joints is prolonged to 6 times than the former ;

超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。

The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization . If we want to raise its packaging density and expand its function further , developing the three dimensional microwave integrated circuits ( 3DMIC ) is the only way .

按工业标准尺寸生产，小型化，组装密度高。

Industry standard size , miniature , high density assembly .

高组装密度器件的散热分析

Thermal Analysis of High Density Packages

光缆组装密度高，缆径小，重量轻，是气吹敷设方式的最佳选择·。

High dense fiber packed , small diameter and light weight ; it 's the better option for blowing .

随着微电子技术的发展，印制电路板的组装密度不断提高，人们越来越重视焊点工作的可靠性。

Along with the development of microelectronic technology , assembly density of printed circuit plate has been uninterruptedly increased .

随着电子设备的日益发展，电子设备外观物理尺寸愈来愈小，而内部的电子元件数目有逐渐增多的趋势，其组装密度和高热密度程度相应加剧的趋势明显。

Along with the development of the electronics equipments , their external appearance physics sizes are become smaller and smaller .

在高组装密度的服务器设计、大规模机群的管理技术、网格路由器技术等方面达到国际领先水平。

Its performance and functionality is in the leading position in the world , especially on high density server designing , massive cluster management technology , and grid router .

电子产品的轻、薄、短、小化对元器件的微型化和组装密度提出了更高的要求。

Electronic products , characterized by " lightness , thinness , shortness and pettiness ", make great demands upon the micro-miniature and the assemble intensity of the components and parts inside .

总体说来，它大概有三次重大的革新：第一次是在上世纪80年代从引脚插入式封装到表面贴片封装，极大地提高了印刷电路板上的组装密度；

General speaking , It has three significant steps of innovation : first is the translation to surface mounting package from through hole package in the end of last eighties , it significantly increase the density of printed wire board ;

分析结果表明非晶薄带组爆炸焊接过程中冲击温升不可忽略，通过调节薄带组装填密度可以控制冲击温升。

Results show out that the impact temperature of multilayer amorphous foils explosive welding can not be neglected , and it can be controlled by adjustment of density of amorphous foils .

对不同水解时间接触角的分析表明，水解时间不同，MPS尾基的水解自聚度不同，延长水解时间能提高组装膜的致密度。

An analysis of contact angle of the monolayer showed that self-polymeric extent of the end-group in MPS can increase with the increase of hydrolysis time and the compact extent of the monolayer can be markedly improved by prolonging hydrolysis time .

实验表明该技术具有结构简单紧凑、易于组装、数据处理密度高和抗环境干扰等优点。

It is shown that the technique is simple and compact in construction , easy to align , capable for high data density and insensitive to environment .

微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。

Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance .

利用自组装技术，将不同浓度比例的对巯基苯胺和N，N'-二苯基硫脲为功能耦联分子，在光滑银基底表面组装不同表面密度的二维银纳米粒子阵列。

Different surface density of silver nanoparticles have been assembled on the smooth silver surface by adjusting the ratio of4-aminothiophenol and N , N ' - diphenylthiourea as coupling molecules .