封装技术
- 网络Package;packaging technology;SiP;WLCSP
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先进的叠层式3D封装技术及其应用前景
Advanced Stacked 3 D Packaging Technology and Its Application Prospects
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正是这种旺盛的需求极大推动了半导体IC封装技术的发展。
This demand enormously impels the development of semiconductor IC packaging technology .
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高亮度高纯度白光LED封装技术研究
Research of the High Luminosity and Purity White LED Encapsulation Technology
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大功率白光LED封装技术可靠性研究
Reasearch on Encapsulation Technology Reliability of High Power White-Light LED
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高效率、高可靠性紫外LED封装技术研究
Study on Packaging Techology of Ultraviolet LED with High Efficiency and Reliability
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整个系统的软件方面采用了模块化设计、多线程设计、Active控件的封装技术。
Modularization , multi-thread design and Active Control Packaging Technology are widely used in this system .
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基于SOA的服务构件封装技术研究
Research on encapsulation of service component based on service-oriented architecture
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经过光学封装技术的改善,可以大幅度地提高大功率LED灯串的出光率(光通量)。
By improving the optical encapsulation , the luminous flux of LED can be improved greatly .
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三维(3-D)封装技术
Three Dimensional ( 3-D ) Packaging Technology
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MEMS封装技术及标准工艺研究
Study on MEMS Packaging Technology and Its Standard Process
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资源配置子系统;射频MEMS封装技术
The subsystem of resource deployment ; RF MEMS Package Technology in Wireless Systems
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敏捷供应链中基于多代理的Legacy系统封装技术
Multi-Agent Based Legacy System Encapsulation in Agile Supply Chain
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高可靠性PIN光电探测器底座封装技术
Dependable Package Technology of PIN Photodetector Base
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MEMS封装技术研究进展与趋势
Development and trends of MEMS packaging technology
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光纤布拉格光栅(FBG)温度传感器增敏封装技术
Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor
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FBG温度传感器增敏封装技术及实验研究
Enhancing-sensitivity packaging technique and experimental study for fiber Bragg grating temperature sensor
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带有MU连接器接口的40Gb/s光接收模块封装技术
Packaging Technology for 40Gb / s Optical Receiver Module with an MU-Connector Interface
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MIS前台应用开发中的DLL封装技术
DLL Packaging Technique in MIS Foreground Application Development
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大功率LD封装技术的研究
New Encapsulation Technique of High Power Semiconductor Lasers
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3D高密度封装技术虽然大幅度提高了器件的性能,但同时也引入了许多可靠性问题。
It is widely used in data storage field.3-D high density packaging technologies have improved device performance significantly but also introduced many reliability problems .
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多协议标记交换VPN的加密与封装技术
Encrypting and Encapsulating Technology of MPLS VPN
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采用容性封装技术提高ESD防护性能研究
Study on Robustness Improved ESD Protection Method by Capacitive Packaging Technology
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在IC制造技术受到物理极限挑战的今天,3D封装技术越来越成为了微电子行业关注的热点。
IC manufacturing faced the challenges of physical limits , 3D packaging technology has increasingly become the focus of the microelectronics industry .
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VLSI高密度封装技术概览
A Survey of VLSI High Density Packaging Technology
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近年来,随着IC制造业的快速发展,对芯片封装技术有了更高的要求。
In recent years , as the rapid growth of IC manufacturing , the IC packaging technology suffers huge challenge .
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3-DMCM封装技术及其应用
3-D MCM Packaging Technology and its Applications
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CSP引发内存封装技术的革命
CSP Causes the Revolution of Memory Chip Package Technology
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高频IGBT模块的封装技术
The Packaging of High Frequency IGBT Module
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MPEG-4的RTP封装技术及其应用
RTP Encapsulation Technology of MPEG-4 and Its Application
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T.三级微电子封装技术
Three Levels Microelectronic Packaging Technology