封装材料

超高速GaAs集成电路封装材料、工艺和结构的研究

Research on Packaging Materials , Processes and Structures for Ultrahigh-Speed GaAs ICs

热阻是热量管理的关键参数，正确的热量管理方法是通过选择合适的封装材料和封装结构，使LED器件的封装热阻最小。

The correct thermal management makes the package thermal resistance of the LED the smallest by choosing the suitable packaging materials and packaging structure .

X射线对双层封装材料剂量增强效应的影响

Effect on Dose Enhancement of Double Deck Package Materials Produced by X-ray

白光LED封装材料对其光衰影响的实验研究

Experimental Research on Influence of Packing Materials of White LED on Its Luminous Decay

随着大功率白光LED发展的日新月异，对LED封装材料的要求亦越来越高。

With the fast development of high power white LEDs , people need better LED packaging material .

随着LED功率及亮度的提高，人们对LED封装材料亦是提出了更高的要求。

With the improvement of LED power and brightness , we put forward more requirements towards LED encapsulation material .

MEMS封装材料数据库系统的设计与实现

Design and Implementation of Packaging Material Database System in MEMS

MEMS器件的封装材料与封装工艺

Package Materials and Processes of MEMS Devices

一种新型电子封装材料70%SiAl合金通过喷射沉积技术被开发出来。

A novel electronic packaging material , silicon-aluminium alloy ( 70 % Si-Al ) has been developed using spray deposition technique .

退火工艺对轧制复合CPC电子封装材料性能的影响

Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

随着LED亮度和功率的不断提高，大功率LED对封装材料的耐老化、折射率和透过率等性能亦提出了更高的要求。

With the improvement of the LED brightness and power , high-power LED has higher requirements for ageing-resistant performance , refractive index and transmittance .

Sn基无铅封装材料研究

A Study on Sn-Based Lead-Free Packaging Materials

PPS高性能电子封装材料的研制

Study on High Performance Poly ( Phenylene Sulfide ) Materials for Electronic Encapsulation

实验采用高压绝缘性能优良的Al2O3作为锰铜敏感元件的封装材料，首次实现了敏感元件清洁的无机固态封装，从根本上消除了高压旁路电阻效应。

Consequently , the manganin sensing elements were ' cleanly ' encapsulated in inorganic solid matrix and the high-pressure shunt effect was eliminated radically .

LED的主要组件有芯片、金属线、支架、导电胶、封装材料，其中封装材料用来密封和保护芯片正常工作。

LED device made up with chips , wires , brackets , conductive adhesives and packaging materials . The function of the packaging materials is to protect the chips .

界面SiO2层对SiC/Al电子封装材料热膨胀系数的影响

Influence of Interface on the Coefficient of Thermal Expansion of SiC / Al Electronic Packaging Composite

本研究综述了MEMS的封装材料，包括陶瓷、塑料、金属材料和金属基复合材料等。

Account of package materials of MEMS , including ceramics , plastic , metal material and metal compound material , etc was given .

等离子喷涂W-Cu电子封装材料的组织与性能

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

退火工艺为900℃/1.5h时，CPC电子封装材料的综合性能最好。

The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours .

目前大功率LED应用于通用照明上还存在着一些问题有待解决，比如新型的封装材料，过高的封装热阻和合适的测试方法等。

Otherwise some key issues should be solved before high power LEDs widely application in general illumination market , such as new package materials , package heat management and suitable measurement method .

论文分为以下四个部分：（1）.综述了LED的发展现状及国内外封装材料的研究进展。

This paper can be divided into four parts . ( 1 ) . The progress and present situation of LED and also present the future development of encapsulate materials were briefly reviewed .

压制压力对Si-Al电子封装材料性能的影响

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

固晶材料是最重要的LED器件封装材料之一，其热物理性能参数和几何尺寸对封装的总热阻具有较大的影响。

Die-attach material is the most important one of all the LED packaging materials , its thermal physical properties and geometric dimensions have a great effect on the total thermal resistance of the package .

热压法制备Si-Al电子封装材料及其性能

Properties of Si-Al Electronic Packaging Materials Fabricated by Hot Pressing

PBGA中环氧模塑封装材料的热力学应力分析

The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA

对粗化后的环氧树脂封装材料表面进行了SEM形貌分析、表面粗糙度及表征亲水性的接触角的计算。

Thus the morphology of the epoxy resin packaging material after coarsening pretreatment was observed using a scanning electron microscope , while its surface roughness and water contact angle were measured .

加入高折光率MQ树脂进行协调补强，可获得机械性能良好、韧性也较好的LED封装材料。

Therefore , high refractive MQ resin was added as reinforcement agent , and silicone materials with good mechanical properties , good toughness and high transmittance were obtained for LED packaging .

经过细化的粉石英、硅微粉、白炭黑等微米甚至纳米级SiO2更是在橡胶补强、紫外屏蔽、电子封装材料等化工领域应用广泛。

Refined , quartz and silica powders , white carbon and nano-SiO2 have been widely used for rubber reinforcement , UV shielding and electronic packaging materials .

Si-Al电子封装材料粉末冶金制备工艺研究

PM Process of Si-Al Electronic Packaging Materials

氮化铝（AlN）陶瓷是最理想的高导热基板和封装材料，可广泛应用于高功率器件、电路和组件。

Aluminum Nitride is an ideal substrate and packaging material applied in high power devices , circuits and modules due to high thermal conductivity .