封装形式

本文的主要工作有：针对LED的封装形式的发展历史，不同封装形式的优缺点。提出COB封装模式是未来功率LED应用的一种趋势。

This main work : With analysis of the development history of the LED package , the advantages and disadvantages of different package forms , the COB package mode is a trend of future power LED application form .

千差万别异曲同工&谈RFID电子标签的封装形式和封装工艺

Talking about RFID Tag 's Package Type and Packaging Process

CPU封装形式的发展

CPU Packaging Forms of Development

38协议中规定的基于UDP的IP传真协议包的组成结构和封装形式以及在实时IP传真中对于速率协商的方法进行了讨论。

( Composed ) structure and encapsulated mode of IP facsimile protocol package based on UDP as well as ( velocity ) arrangement mode are also discussed .

采用非线性有限元方法，分析了CSP封装形式的焊点在给定功率循环下的应力应变。

The three-dimensional nonlinear finite element modeling is used to analyze stress-strain response of solder joint under certain power cycling loading condition .

近几年出现了一种全新的封装形式：球栅阵列封装（BGA）。

Recently , designers developed a new type of package : ball grid array ( BGA ) package .

介绍以AWG为解复用器制作出的1×32解复用模块，并给出了测试过程、测试结果及最后封装形式。

A 1 × 32 DMUX module based on AWG is introduced , giving the process and the result of the test .

以常用的PBGA和CBGA为例，分析了两种不同封装形式BGA通用网板的设计和组装过程中应注意的问题。

Taking as example for PBGA and CBGA , two different package structures of BGA and the attentions during generalstencil design and ass.

从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。

Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package , PCB design , solder paste print , place BGA , and reflow soldering process .

该系列的所有MCU均采用增强型HCS08内核，并提供多种模块、内存大小、类型和封装形式。

All MCUs in the family use the enhanced HCS08 core and are available with a variety of modules , memory sizes , memory types and package types .

介绍了通讯设备过流保护用低阻PTC元件的研究过程，发现TiO2粒度、工艺参数、金属电极以及封装形式对低阻PTC元件的电性能有较大影响。

In Chinese . The low resistance PTC thermistor for over current protection in communication equipment is studied . The results show that the electrical properties are influenced by TiO 2 particle size , technological parameters , metal electrodes , package type , etc.

封装形式为SOT-123的半导体元器件，其外形尺寸十分微小，针对这种半导体元器件设计了自动编带机。

The semiconductor component of SOT-123 is very small in outline dimension . This automatic taping machine is design for it .

封装形式对内存芯片的速度、容量、电气性能、散热效能、抗干扰、品质等产生明显影响本文评价了DRAM的产品类型、市场状况、封装趋势、内存模块动态，并展望了其发展前景

Packaging style can effect the speed , capacity , electronic performance , scatter efficiency , anti-jamming , and quality of the DRAM chip . The DRAM production types , market status , packaging trend , DRAM module developments and the packaging technology 's development foreground are described in this paper

重点介绍了高密度封装形式及应用前景。

Several types of high density packaging and their application prospects are emphatically described .

模块封装形式的设计，合理的封装设计确保电路运行的可靠性和稳定性，并且解决了模块的散热问题。

The appropriate package design can protect the circuit operate reliably and stably and dismiss heat .

随着新型电子元件广泛采用高密度引脚的表面封装形式，造成传统针床和探头的测试设备难以适应。

The package of new electronic components is developing thin and integrated , traditional test equipment is difficult to adapt .

同时产品总体结构上采用独特的安装形式和封装形式实现了产品的小型化。

At the same time , the distinct mounting type and package type to realize the miniature of this product .

作为封装形式之一的金属&玻璃封装，近年来已形成了个庞大的技术产业。

As one of the packaging format metal ─ glass package , in recent years has formed a huge technology industry .

本文简要介绍星用红外探测器的一些封装形式，重点阐述了红外探测器杜瓦组件封装的一些关键技术。

This paper briefly presents some packaging ways of infrared detectors on satellites and mainly describe some critical packaging techniques of infrared detector assembly Dewars .

目前，电子产品以不可阻挡的势头朝向小型化、集成化方向发展，同时对封装形式也提出了更高的要求。

At present , miniaturization and integration are the trends of the electronic product , while the encapsulation technology is also put forward strict requirements .

针对常用高功率电源模块的封装形式和热载荷分布，通过有限元方法先得到模块封装内部的温度场分布形式；

Firstly , the temperature field in the packaging of high-power supply module with the thermal load is calculated by finite element method in this paper .

裸芯片由于其本身具有的特点而被广泛应用于HIC/MCM等新型的封装形式中。

As a result , bare dies are widely used in the new encapsulation technology currently , such as HIC and MCM , because of their advantages .

由于多功能贴片机要处理的元器件封装形式多样，考虑到各种元器件在外形和大小上的差异，对贴片机光源照明技术提出了较高的要求。

Multi-function SMT processes a verity of component packages , taking into account the various components in the shape and size differences . We propose a high technical requirements , the technology is on the SMT illumination .

板上倒装芯片（FCOB）作为一种微电子封装结构形式得到了广泛的应用。

Flip Chip on Board ( FCOB ) has been used widely as a microelectronics packaging structural form .

动态特性视图模型采用封装的形式，它描述系统的动态特性并支持系统的动态仿真；

The encapsulation methodology is used by dynamic performance view model .

本系统涉及到的主要内容如下：第一、应用程序：本系统采取三层封装的形式设计程序。

The system solved the problem of detecting slowly which includes : First , the application : This system took the form of three layers of package to design program .

利用COM对象将驱动模块封装成构件形式。

Packaging the I / O driver into a COM object .

3D封装有两种形式，芯片堆叠和封装堆叠。

The 3 D packaging can be achieved via chip stacking and package stacking .

陶瓷阵列封装的两种形式及其接头可靠性

Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability

为此，网格将其上的各种资源和功能都封装成服务的形式，称作网格服务。

To this end , the grid will have the resources and functions into packaging in the form of services , known as grid services .