回流焊接

从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。

Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package , PCB design , solder paste print , place BGA , and reflow soldering process .

回流焊接工艺与表面贴装技术在科研生产中的应用

The application of reflow soldering and SMT in R & D and production

TAB在二次回流焊接中的缺陷分析及解决办法

Defect Analysis and Solutions for TAB Used in Two-times Reflow

基于加热因子Qη对回流焊接过程进行优化控制。

In this paper reflow profile will be optimized on the basis of heating factor Q η, which determines the fatigue lifetime of solder joint .

波控逆变式精密回流焊接电源的研制

Development of precise inverter reflow-soldering power supply with waveform control

精确控制回流焊接以提高经济效益

Increasing Profit Potential with Precision Control and Monitoring of the Reflow Process

这款模具封装技术与无铅红外线回流焊接工艺兼容。

The molded package is compatible with lead-free IR ( infrared ) soldering processes .

转变到无铅回流焊接还会遇到什么问题？

What other issues can be expected with the conversion to lead-free reflow soldering ?

免清洗回流焊接温度曲线设定及焊接缺陷排除

No-cleaning Reflow Profile and Soldered Defects

在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。

Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly .

传统的经反复试验、反复调整来确定回流焊焊接温度曲线的方法越来越不能适应这一要求，甚至很难完成温度曲线的设置。

After the traditional trial and error , repeated adjustment to determine the method of reflow soldering temperature profile of the increasingly unable to meet this requirement , or even to complete the set temperature curve .

结果发现，在现有试验设计及参数窗口内，焊料的种类，印刷的形状及回流曲线对焊接层空洞率的影响比较大，而焊盘镀层和印刷预压力则影响较小。

In present experimental design and process parameter window , the effects of solder paste type , print mask type and reflow profile were more significant , and the largest void rate was excess 10 % .

城轨供电回流导体与钢轨焊接引发钢轨脆断的警示

Caution about Rail Brittle Fracture Caused by Welding of Power Supply Return Conductor And Rail of Urban Transit