印制线路

为了适应无铅化高温焊接的要求，印制线路板的基材已经从普通性能的材料发展到无铅兼容材料。

In order to meet the requirements of high temperature for lead-free soldering , PCB substrate materials have been developed from the general performance to lead-free compatible materials .

主要论述印制线路板生产中所用的氟硼酸盐镀锡铅溶液。

Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication .

这个系统是为印制线路板计算机辅助制造（PCBCAM）开发的新一代关键设备。

The system is a new key equipment for PCB CAM .

印制线路板（PCB）的孔加工是PCB生产过程的一个重要环节。

Drilling is the key process of PCB 's manufacturing process .

刚-挠结合PCB设计技术刚/挠结合印制线路板技术

Rigid-Flex Printed Circuit Board Technology Design Technology for Flex-rigid PCBs

Fenton法在印制线路板高COD废水处理中的应用

Treatment of PCB Wastewater with High COD by Fenton Method

印制线路EMC设计

Design of EMC in Printed Circuit

OM-25A长臂板厚测量仪用于精密测量覆铜层压板、印制线路板和其它板材的厚度。

OM-25A Over-arm Micrometer is used for precise thickness measurements of laminates , printed circuit boards and other platens .

高散热热匹配多层印制线路板

High heat - Sinking and Heat Matching Multiplaten Printed Circuit Board

一种拆卸印制线路板上多脚元件的新工具

A New Tool for dismounting Multilead Components on Printed Circuit Board

印制线路板中化学镀锡研究现状与发展

Current study status and development of electroless tin plating for PCB

印制线路板上共模电流的辐射干扰预测

Prediction on Radiation Emission Caused by Common Mode Current in PCBs

设计印制线路板应注意问题及解决方法

The Questions in Designing Printed Wiring Board and the Solutions

适用于高频电子机器的阻抗控制印制线路板设计技术

Impedance Controlling Printed Wiring Board Design Technology for High Frequency Electronic Machine

界面设计在印制线路板领域中的应用

Applications of Interphase Design in Printed Circuit Boards Field

多层印制线路板内层铜的黑氧化

Black oxidation for copper in multilayer printed circuit boards

介绍了多层印制线路板内层铜墙表面的黑氧化技术。

Black oxidation technology for copper in multilayer printed circuit board was introduced .

基于神经网络的印制线路板图件识别研究

Research on Recognition of Diagram Pieces Rooting in PCB Based on Neural Network

印制线路板用无卤型覆铜箔层压板&玻纤布·环氧树脂JPCA-ES-04-2000

Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000

数字功放的印制线路板设计

Printed Circuit Board Design for Digital Power Amplifier

废印制线路板真空热解渣分选与组成分析的研究

Separation of vacuum pyrolysis residue from printed scrap circuit board and residue composition determination

多层印制线路板用无卤型粘结片&玻纤布环氧树脂JPCA-ES-06-2000

Halogen-free Prepreg for Multilayer PCB-fiber Glass Epoxy Resin-JPCA-ES-06-2000

主要应用于印制线路板，接插件及半导体领域。

Be suitable in the field of printed circuit board , connector and semiconductor .

全自动导通孔填充制程印制线路板微孔镀铜研究现状

Development Status of Copper Via-filling for PCB

用于印制线路板的三防涂料

Preventive Conformal Coating for Printed Circuit Board

印制线路板的设计

Elementary Introduction to Printed Circuit Board

印制线路板的设计基板的静态测试

Static Tester of Print Circuit Board

具有铜殷钢铜结构的印制线路板

Printed Wiring Boards Constructed With Copper-Invar-Copper

高密度封装进展之四&印制线路板制造技术的发展趋势

Printed Wiring Board Manufacturing Technology Trends

印制线路的抗干扰设计

Antijamming Design of Printed Circuit