倒装

原型模型论视角下的英语倒装句研究

Study of English Inversion from the Perspective of Prototype-model Theory

英汉倒装语序的语用功能分析

Analysis of Pragmatic Function of Inversion in Chinese and English

雅思写作高分句型整理之十：倒装句只有政府采取适当的措施，这个棘手的问题才能被解决。

E : Only if the government will take some appropriate measures , will this intractable problem be tackled .

倒装芯片衬底粘接材料对大功率LED热特性的影响

Impact of Flipchip Substrate Adhesive on the Thermal Characteristic of High Power LED

我一回来他们就开始吵了起来。（hardly提前时，句子需要倒装。）

Hardly had I come back when they began quarrelling .

结果表明，在合适的热超声参数范围内，焊接后的功率型LED光电特性和出光一致性较好，证明了热超声倒装焊接技术是一种可靠有效的功率型光电子器件互连技术。

Thermosonic flip chip bonding is a reliable and efficient connection technique for power optoelectronic devices .

与正装LED相比，倒装焊芯片技术在功率型LED的散热方面具有潜在的优势。

In the aspect of thermal dispersion for power LEDs , flip-chip configuration has potential predominance .

~（60）Co源倒装过程中的剂量安全问题

The problem of radiation safety during transshipment of ~ ( 60 ) co source

倒装焊器件尺寸参数对低k层及焊点的影响

Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability

对各种正装和倒装焊功率型LED芯片的表面温度分布进行了直接测试，对其散热性能进行了分析。

The temperature distribution of power LEDs is measured , and the performance of thermal dispersion is discussed .

设计和分析了InGaAs/GaAs多量子阱SEED中的一种用于倒装焊的新型谐振腔结构。

A new resonant cavity structure of the InGaAs / GaAs MQW SEED arrays has been designed and analyzed .

利用蒙特卡洛射线追踪法研究了各种不同的周期图形阵列对蓝光倒装LED光提取效率的影响。

The effects of periodic arrays on the extraction efficiency of the flip-chip LED were studied by Monte Carlo ray tracing method .

倒装芯片和芯片规模封装对微细间距PCB组件的装配厂商提出了特殊的挑战。

Flip and chip scale packages pose special challenges to assemblers of fine line PCBs .

倒装焊电子封装底充胶分层研究PCB分层设计中控制电磁干扰辐射

Research of underfill delamination of flip chip Restraint of Electromagnetic Interference from PCB Delamination Design

应用于MEMS的芯片倒装技术

Flip-chip technologies in MEMS applications

铜柱形凸点是一种新型的、超高密度的倒装芯片互连形式，将成为下一代IC封装的主流技术。

Cu-Pillar Bumps is a new , ultra-high-density flip-chip interconnect form , which will become the mainstream next-generation IC packaging technology .

避免发生芯片裂纹的倒装片BGA技术概述

Research for Flip - Chip BGA Technology to Avoid Cracking

采用Ansys软件建立BGA倒装芯片模型考察焊点的热应力。

BGA flip chip model was established based on Ansys software to investigate thermal stress in the solder joints .

本文提出了一种大批量层叠封装（PoP）组装方法，这种方法利用了倒装芯片组装中已有的电子封装技术。

This article proposes an approach to high volume Package-on-Package ( PoP ) assembly that leverages the existing electronics packaging technologies for flip chip assembly .

研究表明，焊接层的材料、焊接接触面的面积和焊接层的质量是制约倒装焊LED芯片散热能力的主要因素；

The analytical results show that the solder material , contact area and processing quality of solder layer will be main factors restricting the ability of thermal dispersion for flip-chip configuration LEDs .

从修辞和语用的角度，对英语中的rhetoricalquestion，anastrophe和汉语的设问，倒装两种修辞方法，进行了比较。

This essay compares the rhetorical question and anastrophe in English and Chinese Language in rhetorical and pragmatics respect .

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

The methods of3D interconnection can be classified into the wire bonding , flip chip , through silicon via ( TSV ) and film wire technology , whose advantages and disadvantages are analyzed .

介绍了几种当前先进的MEMS封装技术：倒装焊MEMS、多芯片（MCP）和模块式封装（MOMEMS）。

Additionally , several advanced packaging techniques for MEMS : flip chip for MEMS packaging , multichip package and module MEMS are introduced .

倒装芯片（FC）缺陷往往隐藏于芯片内部，给缺陷检测带来了很大困难。

Defect of flip chip ( FC ) is always hidden between die and substrate , which brings difficulty to inspect defect of FC .

MCM倒装焊技术在CMOS-SEED灵巧象素中的应用研究

MCM Flip-chip-bonding Technique Used in Fabrication of CMOS-S EED Smart Pixel

形成倒装芯片焊点的铜接线柱焊凸（SBC）法

Solder Bump on Copper Stud ( SBC ) Method of Forming the Solder Joint in Flip Chip

倒装芯片凸焊点的UBM

UBM of bumps for flip chip

240m烟囱钢内筒气压顶升倒装施工法

Pneumatic Jacking Inverted Construction for 240 m Stack Inner Steel Cylinder

采用一种自对准制造工艺和倒装芯片的装配技术，研制出GaN基蓝光大功率发光二极管（1mm×1mm）。

The technologies of serf-aligning and flip-chip are adopted to develop GaN based high-power blue light emission diode ( 1mmx1mm ) .

简要分析了MEMS（微机电系统）器件封装的难点所在，随后介绍了晶片键合，晶片级密封，倒装芯片技术等主要的MEMS封装技术。

This paper briefly analyzes the difficulties of MEMS packaging , and elaborates the key techniques of packaging , such as wafer-bonding , wafer level packaging and flip-chip technique . grade .