铝基板
- 网络aluminum substrate;aluminum plate
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公司系列平面变压器已经在铝基板通信电源模块中大批量广泛应用。
Company planar transformer series aluminum plate has communication power module widely used in large quantities .
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大功率LED封装用散热铝基板的制备与性能研究
Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED
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氮化铝基板与Cu和Al的接合及其表面改质效果
Joining of aluminium nitride substrate with copper and aluminium and effect of surface modification
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结果显示金刚石基板应用在多芯片组件中能显著地改善3D-MCM封装的散热性能,明显优于氮化铝基板;在强制空冷时散热功率可达到120W。
The results showed a marked improvement of the thermal performance which CVD-diamond substrates in stacked MCM which is obviously superior than AlN substrates , the maximum heat dissipation is up to 120W under forced air-cooling conditions .
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绝缘金属铝基板的制备及介电性能研究
Research on Preparation and Dielectric Properties of Insulating Metallic Al Substrates
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氮化铝基板流延成型浆料的研究
Study on Slurry for Tape - casting Alumina Nitride Substrate
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铝基板磁控溅射离子镀铜的研究
The Magnetron Sputtering - ion plating of Copper on Aluminium
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设计了基于铝基板的功率集成模块,对它的散热性能进行了分析;
The integrated power module is designed based on aluminum base copper-clad laminate .
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福斯莱特电子铝基板印制电路板的发明者是奥地利人保罗·爱斯勒(PaulEisler),他于1936年在一个收音机装置内采用了印刷电路板。
He applied printed circuit board in a radio receiver device in 1936 .
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铝基板阳极氧化成膜温度与膜层结构
Formed Film Temperature of Anode Oxidation and Structure of Film Layer for Al Metal Substrate
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绝缘铝基板的研究
Study on insulated Aluminium based plates
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双面铝基板的层压工艺
Laminate Process on Double-sided Al-substrates
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样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。
Many new technologies , including soft switching technology , Al substrate , SMT , planar transformer and noise suppressors are applied .
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本研究对铝基板作阳极氧化并电沉积磁性铁纳米线,率先制成了铝基磁性铁纳米线阵列吸波材料。
Firstly , microwave-absorbing aluminum base composites with magnetic iron nanowire array were successfully prepared by electrochemical deposition in porous anodic aluminum oxide template .
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在添加羧酸和有机化合物的硫酸电解液中,采用阳极氧化的方法制备了电路铝基板衬底,研究了电流密度和氧化时间对氧化膜厚度和硬度的影响。
Power substrate was prepared by aluminium anode oxidation in sulfuric acid electrolyte which consists of carboxylic acids and organic compounds . The effects of current density and oxidation time on thickness and hardness of the obtained anodic oxidation film were studied .
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封装用铝金属基板表面金属化图形的制作
Manufacturing of the Metallization Pattern on Al Metal Substrate for Package
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液晶聚酯与氮化铝复合基板材料的研究
Study on the composite of aluminum nitride powder and liquid crystalline polyester
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银基多层氮化铝陶瓷基板低温共烧的工艺研究
Research of LTCC technology of silver-base multilayer AlN ceramic substrates
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利用阳极氧化方法研制了应用于高密度封装中的铝金属基板。对其性能进行了测量。
Anodizing was employed to develop Al metal substrate applied for electronic packaging .
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铝金属基板的制备及性能
Preparation and Properties of Aluminium Metal Substrate
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铝合金基板上磁控溅射离子镀氮化钛膜层的研究
The Investigation of Titanium Nitride Coatings Deposited onto Aluminium alloy by Magnetron Sputtering Ion Plating
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用丝网印刷-烧结工艺,在高铝陶瓷基板上制得了厚约20~30μm,零电阻温度82K的厚膜超导电带。
Then it is printed onto a high-alumina ceramics substrate by silk screen print method . A superconducting wire of thickness in the range of 20 ~ 30 μ m , and zero resistance temperature 82 K , was successfully obtained .
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MEMS封装用氮化铝共烧基板研究
The Study of Aluminum Nitride Co-fire Ceramic Substrate for MEMS Package
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氮化铝共烧基板金属化及其薄膜金属化特性研究
Study of the Character of Aluminum Nitride Co-fire Metalization and Multilayer Thin Film Metalization
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以氮化铝陶瓷为基板的倒装式封装工艺研究
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
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氮化铝颗粒增强聚合物基板材料的制备及介电性能研究
Fabrication and Dielectric Property of Polymer-Matrix Composites Containing AlN Particles for Electronic Substrates
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氮化铝多层共烧基板导带浆料的特性分析
Characters Analysis of Aluminum Nitride Co-fire Multi-layer Ceramic Substrate
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氮化铝陶瓷覆铜基板的研制
Preparation of the copper metallized aluminum nitride substrate
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碳纤维/铝蜂窝太阳翼基板热变形分析
Analysis of Thermal-elastic Deformation for Solar Array Substrate with CFRP / Aluminum Honeycomb Sandwich
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铝/氮化铝电子陶瓷基板的制备及性能的研究
Performance of Al / AlN Substrate