铝基板

公司系列平面变压器已经在铝基板通信电源模块中大批量广泛应用。

Company planar transformer series aluminum plate has communication power module widely used in large quantities .

大功率LED封装用散热铝基板的制备与性能研究

Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED

氮化铝基板与Cu和Al的接合及其表面改质效果

Joining of aluminium nitride substrate with copper and aluminium and effect of surface modification

结果显示金刚石基板应用在多芯片组件中能显著地改善3D-MCM封装的散热性能，明显优于氮化铝基板；在强制空冷时散热功率可达到120W。

The results showed a marked improvement of the thermal performance which CVD-diamond substrates in stacked MCM which is obviously superior than AlN substrates , the maximum heat dissipation is up to 120W under forced air-cooling conditions .

绝缘金属铝基板的制备及介电性能研究

Research on Preparation and Dielectric Properties of Insulating Metallic Al Substrates

氮化铝基板流延成型浆料的研究

Study on Slurry for Tape - casting Alumina Nitride Substrate

铝基板磁控溅射离子镀铜的研究

The Magnetron Sputtering - ion plating of Copper on Aluminium

设计了基于铝基板的功率集成模块，对它的散热性能进行了分析；

The integrated power module is designed based on aluminum base copper-clad laminate .

福斯莱特电子铝基板印制电路板的发明者是奥地利人保罗·爱斯勒（PaulEisler），他于1936年在一个收音机装置内采用了印刷电路板。

He applied printed circuit board in a radio receiver device in 1936 .

铝基板阳极氧化成膜温度与膜层结构

Formed Film Temperature of Anode Oxidation and Structure of Film Layer for Al Metal Substrate

绝缘铝基板的研究

Study on insulated Aluminium based plates

双面铝基板的层压工艺

Laminate Process on Double-sided Al-substrates

样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。

Many new technologies , including soft switching technology , Al substrate , SMT , planar transformer and noise suppressors are applied .

本研究对铝基板作阳极氧化并电沉积磁性铁纳米线，率先制成了铝基磁性铁纳米线阵列吸波材料。

Firstly , microwave-absorbing aluminum base composites with magnetic iron nanowire array were successfully prepared by electrochemical deposition in porous anodic aluminum oxide template .

在添加羧酸和有机化合物的硫酸电解液中，采用阳极氧化的方法制备了电路铝基板衬底，研究了电流密度和氧化时间对氧化膜厚度和硬度的影响。

Power substrate was prepared by aluminium anode oxidation in sulfuric acid electrolyte which consists of carboxylic acids and organic compounds . The effects of current density and oxidation time on thickness and hardness of the obtained anodic oxidation film were studied .

封装用铝金属基板表面金属化图形的制作

Manufacturing of the Metallization Pattern on Al Metal Substrate for Package

液晶聚酯与氮化铝复合基板材料的研究

Study on the composite of aluminum nitride powder and liquid crystalline polyester

银基多层氮化铝陶瓷基板低温共烧的工艺研究

Research of LTCC technology of silver-base multilayer AlN ceramic substrates

利用阳极氧化方法研制了应用于高密度封装中的铝金属基板。对其性能进行了测量。

Anodizing was employed to develop Al metal substrate applied for electronic packaging .

铝金属基板的制备及性能

Preparation and Properties of Aluminium Metal Substrate

铝合金基板上磁控溅射离子镀氮化钛膜层的研究

The Investigation of Titanium Nitride Coatings Deposited onto Aluminium alloy by Magnetron Sputtering Ion Plating

用丝网印刷-烧结工艺，在高铝陶瓷基板上制得了厚约20～30μm，零电阻温度82K的厚膜超导电带。

Then it is printed onto a high-alumina ceramics substrate by silk screen print method . A superconducting wire of thickness in the range of 20 ~ 30 μ m , and zero resistance temperature 82 K , was successfully obtained .

MEMS封装用氮化铝共烧基板研究

The Study of Aluminum Nitride Co-fire Ceramic Substrate for MEMS Package

氮化铝共烧基板金属化及其薄膜金属化特性研究

Study of the Character of Aluminum Nitride Co-fire Metalization and Multilayer Thin Film Metalization

以氮化铝陶瓷为基板的倒装式封装工艺研究

Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate

氮化铝颗粒增强聚合物基板材料的制备及介电性能研究

Fabrication and Dielectric Property of Polymer-Matrix Composites Containing AlN Particles for Electronic Substrates

氮化铝多层共烧基板导带浆料的特性分析

Characters Analysis of Aluminum Nitride Co-fire Multi-layer Ceramic Substrate

氮化铝陶瓷覆铜基板的研制

Preparation of the copper metallized aluminum nitride substrate

碳纤维/铝蜂窝太阳翼基板热变形分析

Analysis of Thermal-elastic Deformation for Solar Array Substrate with CFRP / Aluminum Honeycomb Sandwich

铝/氮化铝电子陶瓷基板的制备及性能的研究

Performance of Al / AlN Substrate