金刚石切割片

提高复合电沉积金刚石切割片性能的试验研究

Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade

新型风冷式金刚石切割片

A New Type of Diamond Dry Cutting Saw Blade

为了考察金刚石切割片的切割性能，在划片机床上进行了硅片与玻璃钢的划切试验。

In order to investigate the dicing properties of the diamond blades , experiments of dicing silicon wafers and glass fibre reinforced plastic are carried out on the dicing machining equipment .

并介绍了作者最近研究成功的新型风冷式金刚石切割片的结构特点、制造方法和使用效果。

A novel type diamond dry cutting wheel , newly developed by the authors , is introduced , and some of its structure characteristics , production methods and application results are also presented .

在IC芯片制造过程中，将排布在硅晶圆上的集成电路切割分离是其中一个重要的工序，目前用于切割分离集成电路的刀具主要是金刚石超薄切割片。

In process of fabricating integrated circuit , a key technique is to separate the integrated circuits on the silicon wafers .

晶须增强光敏树脂结合剂超薄金刚石切割砂轮片的研究

Development of diamond ultrathin dicing blade with Whisker-Enhanced photosensitive resin

本文以快速原型制造技术为基础，研究以光敏树脂作为结合剂的超薄金刚石切割砂轮片的快速制造技术。

This paper studies a new method for developing resin bonded diamond ultrathin dicing blade based on rapid prototyping techniques .

往复式电镀金刚石线锯切割单晶硅片特性研究基于磨损行为的单晶硅片化学机械抛光材料的去除特性

Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior

磁性对人造金刚石单晶机械性能的影响往复式电镀金刚石线锯切割单晶硅片特性研究

Study on the Influence of Magnetism of Synthetic Diamond Single Crystal on Their Mechanical Performances Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw