软钎焊

软钎焊钎料的最新发展动态

The New Development in Solder Alloys

钛板与陶瓷板（Al2O3）的软钎焊

Soldering Between Ceramic Substrate ( Al_2O_3 ) and Metal Titanium Carrier

半导体激光软钎焊Sn-Ag-Cu焊点微观组织

Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering

介绍了某雷达T/R组件上用作接地散热金属板的钛板与以Al2O3陶瓷为基板的电路板间的软钎焊技术。

The technique for soldering ceramic microwave circuit substrate ( Al 2O 3 ) and titanium carrier which are used in T / R module for phased-array radar is described .

研究结果表明，半导体激光软钎焊不仅能够大幅度地提高Sn-Ag-Cu钎料QFP微焊点的抗拉强度，而且也能够明显地改善Sn-Pb钎料QFP微焊点的抗拉强度。

Results indicate that diode-laser soldering can obviously improve both the tensile strength of the joints with Sn-Ag-Cu solder and the strength of the joints with Sn-Pb solder .

采用90W半导体激光软钎焊系统对方形扁平式封装器件（QFP）进行了焊接试验研究，并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。

Soldering technology for quad flat pack devices ( QFP ) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power .

半导体激光焊接系统的特点及其在无铅软钎焊中的应用

Characteristic of diode-laser soldering system and its application in lead-free soldering

电子封装软钎焊焊点形态预测技术研究现状

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

光纤固定软钎焊焊点的三维形态模拟

Simulation of Three-Dimensional Shape of Solder Joint in Optical Fiber Attachment Soldering

电子软钎焊材料的研究进展

The Research Progress on Soldering Materials for Electronics Industry

激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。

Laser soldering technology has been found an important application in micro-electronic joining and packaging .

脉冲频率及扫描方式对光纤激光软钎焊的影响

Effects of Laser Pulse Frequency and Scanning Mode on Welding Quality in Soldering by Fiber Laser

无钎剂软钎焊技术可以从根本上解决因钎剂的副作用而带来的一系列问题。

Fluxless soldering can solve a series of problems caused by the side effect of flux essentially .

为满足钎焊原理和条件的要求，选用软钎焊封接工艺，对锗窗口进行了金属化处理。

For realizing the soldering , soft soldering seal process has been used and the Ge window is metalized .

本文采用激光软钎焊并利用液态钎料表面张力的作用实现光纤的无源自对准。

Laser soldering system was used to study the passive self alignment of the fiber by using surface tension of the molten solder .

本文综述了该合金系研究的主要成果，包括微观组织、焊料与基体的相互作用、拉伸和剪切性能、疲劳性能及蠕变性能，指出了此合金系作为软钎焊材料尚待解决的问题。

This paper reviews the research progress of microstructure , interaction of solders and substrates , tensile and shear properties , creep resistance and fatigue resistance .

在电子制造过程中，可焊性是一个重要的概念，它主要指材料易于采用软钎焊进行焊接的能力。

In the process of electronics manufacturing , solderability , which refers to the capability of soldering between solder and substrate , is an important concept .

模具改进的结果表明，挤压熔点在300℃以下的软钎焊材料时，其效果较佳。

The test results indicated that , the improved mold had better performance for extruding the soft solders with melting point of300 ℃ and the below .

通过改进软钎焊材料的挤压模具，使其具有排气和排油功能，减少产品夹杂气体、裹油起皮（或毛刺）等缺陷，延长模具的使用寿命。

By improving extruding die for soft soldering materials with air & oil discharging function , product defects were reduced , and the operation life of die was extended .

概述了近年来国内外电子封装软钎焊焊点形态预测研究工作的进展及尚未解决的问题，供有关人员参照。

International and internal progress in solder joint shape prediction in electronic packaging are overviewed and some unredeemed problems are mentioned as reference for some researchers in the field .

Zn对Sn-Ag-Bi系软钎料钎焊性能影响的研究

Effect of Zn on the Solderability of the Sn-Ag-Bi Solders

结果表明，用研制的新型高强软钎料钎焊高强度ZA合金获得的钎焊接头在界面区局部有交互结晶产生；

The results show that interactive crystallization exists in the interfacial region by using a new developed high strength soldering filler metal .

讨论了电子软钎料的钎焊性能及其影响因素，并采用铺张面积法对Sn-Zn-Ag系钎料钎焊性能进行评估。

The solderability of electronic solders and effect of some factor on the solder ability were discussed . And the test method of spreading areas was used to evaluate the solderability of the Sn-Zn-Ag family of solder .