球阵列封装

用于高速光电组件的光焊球阵列封装技术

Optical BGA Packaging Technology for high-speed Optoelectronic modules

近几年出现了一种全新的封装形式：球栅阵列封装（BGA）。

Recently , designers developed a new type of package : ball grid array ( BGA ) package .

按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。

Leaded and lead-free BGA ( ball grid array ) components were tested in board level drop test defined in the JEDEC ( Joint Electron Device Engineering Council ) standard .

球栅阵列封装的应力应变及热失效研究

Study on Stress-Strain and Thermal Failure of Ball Grid Array Package

超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势

Comparison between Ultra-fine Pitch QFPs and BGAs and their Future

球栅阵列封装焊点寿命预测的综合方法

Integrated life prediction method of ball grid array soldered joint

模拟结果表明，无铅球栅阵列封装器件上的应变、应力最大点均发生在焊球分布不均匀处。

Simulation results indicate that the maximum points of the stress and strain are all in the non-uniform distribution part of the lead-free plastic ball grid array device .

在大规模集成芯片中以BGA（球栅阵列）封装的IC芯片被广泛使用。

In large scale integrated chip field , the IC of BGA encapsulation was widely used .

复合球栅阵列CBGA封装器件热循环损伤的有限元模拟

Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array

芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package

应用弹粘塑性有限元法对芯片叠层球栅阵列尺寸封装的焊球，在热循环条件下（-40～125℃）进行了数值模拟，并在此基础上进行了可靠性分析。

Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size , stacked , chip scale , ball grid array package under accelerated temperature cycling conditions ( - 40 ~ 125 ℃) .

本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。

Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper .

球栅阵列倒装焊封装中的热应变值的测试

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints